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antimony-telluride

VD0857 Antimony Telluride Evaporation Materials, Sb2Te3

Catalog No.VD0857
MaterialAntimony Telluride (Sb2Te3)
Purity99.9% ~ 99.999%
ShapePowder/ Granule/ Custom-made

TFM stands out as a premier producer and supplier of top-quality antimony telluride evaporation materials, along with an extensive range of other evaporation materials. Our offerings include both powder and granule forms, and we can also provide customized solutions to meet specific needs.

MSDS File

Antimony Telluride Evaporation Materials Overview

TFM offers premium antimony telluride evaporation materials, featuring the chemical formula Sb2Te3. This high-purity telluride ceramic is essential for ensuring high-quality deposition films in various processes. We produce Sb2Te3 evaporation materials with purity levels reaching up to 99.9995%, utilizing rigorous quality assurance measures to ensure reliability and excellence.

Specifications of Antimony Telluride Evaporation Materials

Material TypeAntimony Telluride
SymbolSb2Te3
Appearance/ColorGrey solid
Melting Point620 °C (1,148 °F; 893 K)
Density6.50 g cm−3
Purity99.9% ~ 99.999%
ShapePowder/ Granule/ Custom-made

Applications

Antimony telluride evaporation materials are crucial in various deposition techniques, including semiconductor deposition, chemical vapor deposition (CVD), and physical vapor deposition (PVD). They are primarily used in optics for applications such as wear protection, decorative coatings, and displays.

Packaging

Our antimony telluride evaporation materials are securely packed in plastic vacuum bags to protect them during storage and transport, maintaining their quality and integrity. Each package includes a Certificate of Analysis (COA) for the raw material.

Contact Us

At TFM, we excel in producing high-purity antimony telluride evaporation materials tailored for use in semiconductors, CVD, PVD, and optical applications. Our combined expertise in engineering, manufacturing, and analysis ensures we deliver industry-leading products. Contact us today to inquire about our offerings.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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