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VD0810C Arsenic Triselenide Pellet Evaporation Material (As2Se3)

MSDS File
Material TypeArsenic Triselenide
SymbolAs2Se3
Melting Point (°C)~360
Theoretical Density (g/cc)4.75
Z Ratio
E-Beam
E-Beam Crucible Liner Material
Temp. (°C) for Given Vap. Press. (Torr)
Comments

Arsenic Triselenide Pellet Evaporation Material

TFM provides high-purity Arsenic Triselenide (AsSe₃) Pellet Evaporation Material, a crucial compound for thin-film deposition, optoelectronics, and semiconductor research. Known for its exceptional optical and electronic properties, this material is widely used in infrared detectors, photodetectors, and advanced electronic devices.

Key Features and Advantages

  • High Purity (99.99% – 99.999%) – Ensures superior performance in thin-film deposition and optical applications.

  • Superior Optical Properties – Provides high transmission and low absorption in the infrared spectrum, ideal for infrared sensors.

  • Optimized for Thin-Film Deposition – Compatible with thermal evaporation and E-beam evaporation techniques.

  • Stable & Uniform Coating – Delivers consistent film quality, essential for high-efficiency optoelectronic devices.

  • Customizable Composition – Tailored to meet specific application needs, allowing for adjustments in optical and electrical performance.

Applications

  • Infrared Detectors & Sensors – Ideal for thermal imaging and infrared detection in security, military, and scientific applications.

  • Photodetectors & Photovoltaic Devices – Used in solar cells and optical communication systems.

  • Thin-Film Transistors & Semiconductor Devices – Applied in transparent electronics, displays, and advanced sensor technologies.

  • Optoelectronic Devices – Ideal for LEDs, lasers, and optical modulators.

Industry Impact

TFM’s Arsenic Triselenide Pellet Evaporation Material is a high-performance material with outstanding optical and electronic properties, making it indispensable in infrared detection, solar energy, and optoelectronic device fabrication. Its high purity, stable deposition characteristics, and tailored performance make it a top choice for innovative applications in advanced electronics and material research.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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