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VD0810D Arsenicum Sulfide Pellet Evaporation Material (As3S3)

MSDS File
Material TypeArsenic Sulfide
SymbolAs2S3
Color/AppearanceOrange crystals
Melting Point (°C)310
Theoretical Density (g/cc)3.43
Z Ratio–
E-BeamFair
Thermal Evaporation TechniquesBoat:  Mo
Crucible:  Al2O3, Q
E-Beam Crucible Liner Material–
Temp. (°C) for Given Vap. Press. (Torr)10-4:  ~400
Comments–

Arsenicum Sulfide Pellet Evaporation Material

TFM offers high-purity Arsenicum Sulfide Pellet Evaporation Material, a versatile compound used in thin-film deposition, optoelectronics, and semiconductor research. Known for its unique optical and electrical properties, this material is widely applied in infrared sensors, photodetectors, and advanced electronic components.

Key Features and Advantages

  • High Purity (99.99% – 99.999%) – Ensures optimal performance in thin-film deposition and electronic applications.

  • Superior Optical & Electrical Properties – Ideal for infrared transmission and light-sensitive devices.

  • Optimized for Thin-Film Deposition – Compatible with thermal evaporation and E-beam evaporation techniques.

  • Stable & Uniform Coating – Delivers consistent quality in thin-film coatings, crucial for high-efficiency devices.

  • Customizable Composition – The arsenic/sulfur ratio can be adjusted to meet specific application requirements.

Applications

  • Infrared Detectors & Sensors – Ideal for thermal imaging and infrared detection in military, medical, and industrial applications.

  • Photodetectors – Used in light-sensitive devices and optical communication systems.

  • Semiconductor Research – Supports cutting-edge material science in electronic devices and sensor technologies.

  • Thin-Film Solar Cells – Applied in photovoltaic devices to enhance solar energy conversion efficiency.

Industry Impact

TFM’s Arsenicum Sulfide Pellet Evaporation Material plays a crucial role in advancing infrared detection, optoelectronics, and renewable energy applications. Its high purity, outstanding optical properties, and reliable deposition characteristics make it an ideal choice for innovative technologies in electronic, photodetector, and solar energy applications.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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