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ST0412 AZO Sputtering Target, Aluminum-doped Zinc Oxide

Chemical Formula: AZO
Catalog Number: ST0412
CAS Number: 37275-76-6
Purity: 99.9%, 99.95%, 99.99%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Aluminum-Doped Zinc Oxide (AZO) sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

AZO Sputtering Target Description

An AZO sputtering target, or aluminum-doped zinc oxide target, contains the elements aluminum (Al), zinc (Zn), and oxygen (O). This combination is used to create thin films with specific electrical and optical properties, often employed in applications such as transparent conductive coatings and other electronic devices.

Aluminum

Aluminum, also known as aluminium, is a chemical element derived from the Latin name “alum,” with “alumen” meaning bitter salt. The standard chemical symbol for aluminum is “Al.” Aluminum films are commonly used as reflective coatings on telescopes, car headlights, mirrors, packaging, and toys. The aluminum sputtering target is widely utilized in the aerospace, automotive lighting, OLED, and optical industries.

Related Product:  Aluminum sputtering target

ZincZinc is a chemical element with the symbol “Zn” and an atomic number of 30. The name “zinc” originated from the German word “zinc,” and it is also believed to be derived from the Persian word “sing,” meaning stone.

Related Product:  Zinc Sputtering Target

AZO Sputtering Target Specification

Material Type Aluminum doped Zinc Oxide
Symbol AZO
Appearance Solid in various forms
Available Sizes Dia.: 1.0″, 2.0″, 3.0″, 4.0″, 5.0″, 6.0″
Thick: 0.125″, 0.250″

AZO Sputtering Target Manufacturing Process

  • Manufacturing
    • Cold Pressing: The high-purity material is initially formed into the desired shape and size through cold pressing.
    • Sintering: The pressed material is then sintered at high temperatures to enhance its density and mechanical strength.
    • Elastomer Bonding: The sintered target is elastomer bonded to a backing plate to ensure stability and durability during its use.
  • Cleaning and Final Packaging
    • Cleaning: The sputtering targets are meticulously cleaned to ensure they are free from contaminants, making them suitable for use in vacuum environments.
    • Protection from Environmental Contaminants: Measures are taken to protect the targets from environmental contaminants that could affect their performance.
    • Protection During Shipment: The targets are carefully packaged to prevent any damage during transportation, ensuring they arrive in perfect condition for use.

AZO Sputtering Target Application

The AZO sputtering target, composed of aluminum-doped zinc oxide, is used for thin film deposition in various applications, including fuel cells, decorative coatings, semiconductors, displays, LEDs, photovoltaic devices, and glass coatings. Aluminum-doped zinc oxide has been investigated as a potential replacement for indium tin oxide (ITO) in solar cells due to concerns over indium shortages and rising prices.

Packing

The Aluminum-Doped Zinc Oxide (AZO) sputtering target is clearly tagged and labeled externally to ensure efficient identification and quality control. Great care is taken to avoid any damage that might occur during storage or transportation, ensuring the product arrives in perfect condition.

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TFM offers Aluminum-Doped Zinc Oxide (AZO) Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.
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AZO Target 97:3 wt% 4N ø50.8*5mm, AZO Target 98:2 wt% 4N ø76.0*5.5mm, AZO Target 4N ø76.2*3.18mm Indium Bonded 3mm Cu B/Plate

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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