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VD0536 Barium (Ba) Evaporation Materials

Material Type: Barium
Symbol: Ba
Color/Appearance: Silvery White, Metallic
Shape：Powder/ Granule/ Custom-made

TFM supplies high-purity barium evaporation materials, establishing itself as a leading manufacturer and supplier in the field. We offer these materials in powder, granule, and customized forms to meet specific needs.

MSDS File

Barium Evaporation Materials Description

High-purity barium evaporation materials are essential for achieving high-quality films in deposition processes. TFM specializes in producing barium evaporation materials with purity levels up to 99.5%, utilizing rigorous quality assurance processes to ensure product reliability.

barium evaporation materials

Barium Evaporation Materials Specification

Material TypeBarium
SymbolBa
Color/AppearanceSilvery White, Metallic
Melting Point725 °C
Density3.51 g/cm3

Barium Evaporation Materials Applications

  • Deposition Processes: Utilized in semiconductor deposition, chemical vapor deposition (CVD), and physical vapor deposition (PVD).
  • Optics: Applied in wear protection, decorative coatings, and display technologies.

Barium Evaporation Materials Packaging

We take meticulous care in handling our evaporation pellets to avoid damage during storage and transportation, ensuring that they maintain their original quality and condition.

Ordering Table 

VD0536 Barium (Ba) Evaporation Materials

Material Size Quantity Purity Part Number
Barium 3mm - 6mm Pieces 200 g 99.5% EVMBA253-6MM
Barium 3mm - 6mm Pieces 25 g 99.5% EVMBA3-6MMA
Barium 3mm - 6mm Pieces 50 g 99.5% EVMBA3-6MMB
Barium 3mm - 6mm Pieces 100 g 99.5% EVMBA3-6MMD
Barium 3mm - 6mm Pieces 500 g 99.5% EVMBA3-6MMT

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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