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ST0234 Barium Fluoride Sputtering Target, BaF2

Chemical Formula: BaF2
Catalog Number: ST0234
CAS Number: 7787-32-8
Purity: 99.9%, 99.95%, 99.99%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Barium Fluoride sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Barium Fluoride Sputtering Target Description

Barium Fluoride Sputtering Target from TFM is a fluoride ceramic material with the chemical formula BaF2.

BariumBarium, a soft and silvery alkaline earth metal, is the fifth element in group 2 of the periodic table. Due to its high reactivity, barium is not found in nature as a free element. Historically known as baryta, barium hydroxide doesn’t naturally occur as a mineral but can be produced by heating barium carbonate. The primary minerals containing barium are barite (barium sulfate, BaSO4) and witherite (barium carbonate, BaCO3), both of which are insoluble in water. The name “barium” is derived from the Greek word “barys,” meaning “heavy,” reflecting its high density.

Related Product: Barium Sputtering Target

FluorineFluorine, sometimes referred to as fluorin, is a chemical element whose name is derived from the Latin word ‘fluere,’ meaning ‘to flow.’ It was first noted in 1810 and observed by A.-M. Ampère. The element was later successfully isolated by H. Moissan. Fluorine is represented by the chemical symbol “F” and has an atomic number of 9 in the periodic table. It is located in Period 2 and Group 17, classified within the p-block. The relative atomic mass of fluorine is approximately 18.9984032(5) Dalton, with the number in brackets indicating the measurement uncertainty.

Barium Fluoride Sputtering Target Specification

Compound FormulaBaF2
Molecular Weight175.32
AppearanceSolid
Melting Point1,291° C
Boiling Point2260° C
Density4.9 g/cm3

Barium Fluoride Sputtering Target Packaging

Our barium fluoride sputtering target is meticulously tagged and labeled externally for precise identification and quality control. We take great care in handling and packaging to prevent any damage during storage or transportation, ensuring the product’s integrity and quality are maintained upon arrival.

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TFM offers Barium Fluoride Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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