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Barium Strontium Titanate Evaporation Materials

VD0672 Barium Strontium Titanate Evaporation Materials, Ba0.5Sr0.5TiO3

Catalog No.VD0672
MaterialBarium Strontium Titanate (Ba0.5Sr0.5TiO3)
Purity99.9%
ShapePowder/ Granule/ Custom-made

Thin-Film Mat Engineering (TFM) specializes in manufacturing and supplying high-purity barium strontium titanate (BST) evaporation materials. We provide a diverse range of evaporation materials, available in both powder and granule forms. Custom solutions can be tailored to meet specific requirements upon request.

MSDS File

Barium Strontium Titanate Evaporation Materials Overview

Thin-Film Mat Engineering (TFM) offers high-purity barium strontium titanate (BST) evaporation materials with the chemical formula Ba₀.₅Sr₀.₅TiO₃. These materials are essential for ensuring high-quality film deposition processes. TFM provides BST evaporation materials with up to 99.9995% purity, backed by rigorous quality assurance protocols to ensure reliability.

Related Products: Barium Evaporation Materials, Strontium Evaporation Materials, Titanium Evaporation Materials

Applications

Barium strontium titanate evaporation materials are utilized in:

  • Deposition Processes: Crucial for semiconductor deposition, chemical vapor deposition (CVD), and physical vapor deposition (PVD).
  • Optics: Employed in wear protection, decorative coatings, and display technologies.

Packaging and Handling

Our BST evaporation materials are carefully tagged and labeled to ensure proper identification and quality control. We take stringent measures to prevent damage during storage and transportation.

Contact Us

Thin-Film Mat Engineering (TFM) is a leading provider of high-purity barium strontium titanate evaporation materials. We offer a variety of forms, including tablets, granules, rods, and wires, with custom shapes and quantities available upon request. We also supply evaporation sources, boats, filaments, crucibles, heaters, and e-beam crucible liners. For current pricing and to inquire about materials not listed, please contact us directly.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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