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barium-sulfide

VD0811 Barium Sulfide Evaporation Materials, BaS

Catalog No.VD0811
MaterialBarium Sulfide (BaS)
Purity99.9%
ShapePowder/ Granule/ Custom-made

TFM excels as a premier manufacturer and supplier of high-purity barium sulfide evaporation materials, alongside a broad range of other evaporation products. Our materials are available in both powder and granule forms, with the added option for customized forms to suit specific requirements upon request.

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Barium Sulfide Evaporation Materials Overview

Barium sulfide (BaS) is a crucial sulfide ceramic material used in evaporation processes. Our high-purity barium sulfide materials are essential for producing high-quality films in various deposition applications. TFM excels in crafting barium sulfide with purity levels reaching up to 99.9995%, employing stringent quality control measures to ensure product reliability.

Related Products: Barium Evaporation Materials, Sulfide Ceramic Evaporation Materials

Specifications of Barium Sulfide Evaporation Materials

Material TypeBarium sulfide
SymbolBaS
Appearance/ColorWhite solid
Melting Point2,235 °C (4,055 °F; 2,508 K)
Density4.25 g/cm
Purity99.9%
ShapePowder/ Granule/ Custom-made

Applications of Barium Sulfide Evaporation Materials

Barium sulfide evaporation materials are widely used in various deposition techniques such as semiconductor deposition, chemical vapor deposition (CVD), and physical vapor deposition (PVD). They are particularly valuable in the production of optical coatings, including wear-resistant layers, decorative finishes, and display components.

Packaging and Handling

Our barium sulfide evaporation materials are meticulously packaged and clearly labeled to facilitate easy identification and maintain quality during storage and transport. We ensure that each package is handled with care to prevent any damage.

Contact Us

TFM is a premier provider of high-purity barium sulfide evaporation materials. We offer a range of shapes, including tablets, granules, rods, and wires, with customization options available. In addition to evaporation materials, we also supply evaporation sources, boats, filaments, crucibles, heaters, and e-beam crucible liners. For pricing and inquiries on evaporation materials and other products not listed, please reach out to us.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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