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VD0673 Barium Zirconate Evaporation Materials, BaZrO3

Catalog No.VD0673
MaterialBarium Zirconate (BaZrO3)
Purity99.9%
ShapePowder/ Granule/ Custom-made

Thin-Film Mat Engineering (TFM) is a premier producer and provider of high-purity barium zirconate and an extensive range of other evaporation materials. We supply these materials in both powder and granule formats, with the option for customized forms to meet specific needs.

MSDS File

Barium Zirconate Evaporation Materials

Product Overview

Barium zirconate (BaZrO3) is a high-purity evaporation material essential for achieving exceptional quality in thin film deposition. At Thin-Film Mat Engineering (TFM), we specialize in supplying barium zirconate with purity levels up to 99.9995%. Our rigorous quality assurance processes guarantee the reliability and performance of our products across various applications.

Applications

Barium zirconate evaporation materials are utilized in several critical applications, including:

  • Semiconductor Deposition: Crucial for producing high-quality semiconductor films.
  • Chemical Vapor Deposition (CVD) and Physical Vapor Deposition (PVD): Employed in various industrial processes to apply thin films.
  • Optics: Used in wear protection, decorative coatings, and display technologies.

Packaging and Handling

Our barium zirconate materials are meticulously packaged to preserve their integrity during storage and transportation. Each package is clearly tagged and labeled to ensure efficient identification and quality control.

Additional Products

Beyond barium zirconate, TFM offers a diverse range of evaporation materials, including zirconium and tungsten. We provide various forms of evaporation sources, such as tablets, granules, rods, wires, and custom shapes tailored to specific requirements. We also offer evaporation sources, boats, filaments, crucibles, heaters, and e-beam crucible liners. For pricing details or to inquire about materials not listed, please contact us.

Contact Us

For more information on pricing and additional details about our evaporation materials and other products, please send us an inquiry. We are dedicated to fulfilling your specific needs with high-quality materials and dependable service.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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