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ST0880 Beryllium Copper Sputtering Target, BeCu

Chemical Formula: BeCu
Catalog Number: ST0880
CAS No.: 11108-64-8
Purity: 99.999%
Shape: Planar, Rotary, Custom-made

Beryllium Copper sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Beryllium Copper Sputtering Target Description

Beryllium Copper Sputtering Target

The Beryllium Copper Sputtering Target from TFM is an alloy sputtering material with the formula BeCu. This target features superior strength and hardness compared to standard copper alloys and exhibits excellent resistance to stress relaxation at high temperatures.

Related Product: Rotatory Copper (Cu) Sputtering Target, Beryllium Oxide Sputtering Target

Beryllium Copper Sputtering Target Specifications

MaterialBeryllium Copper
SymbolBeCu
Color/AppearanceGolden, metallic
Melting Point870-980 ℃
Density (g/cm3)8.6
Available sizesPlanar: 500x500x10mm

Rotary: L4000mm

Beryllium Copper Sputtering Target Applications

The Beryllium Copper Sputtering Target is used in applications such as shielding rooms, IC shielding layers, and decorative coatings.

Beryllium Copper Sputtering Target Packing

Our Beryllium Copper Sputtering Target is clearly tagged and labeled externally to ensure efficient identification and quality control. We take great care to prevent any damage during storage or transportation.

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TFM offers Beryllium Copper  Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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