Product Overview
| Item | Available / Information to Confirm |
|---|---|
| Material | Elemental Beryllium, Be |
| CAS Number | 7440-41-7 |
| Catalog Number | TFM-SPT-0054 |
| Purity | 2N–3N options may be reviewed; higher-purity or project-specific impurity requirements should be confirmed case by case |
| Forms | Disc, rectangular plate, thin target, bonded target, segmented target, or drawing-specific geometry |
| Current Catalog Examples | Standard planar discs and custom dimensions may be reviewed; final available sizes, thicknesses, and stock status should be reconfirmed before quotation |
| Mounting / Cathode | Standard planar magnetron cathodes, custom recesses, shoulders, center-hole interfaces, or drawing-specific mounting configurations |
| Bonding | Unbonded or bonded to copper / system-specific backing plates after technical review |
| Sputtering Mode | DC magnetron sputtering may be considered for metallic Be; pulsed DC, RF, and reactive processes should be reviewed according to cathode design and desired film chemistry |
| Surface Condition | Machined, ground, cleaned, protected, or drawing-specific surface and edge condition |
| Handling / Safety | Beryllium requires strict control of dust and particulate exposure during machining, handling, cleaning, and disposal; appropriate EHS procedures and local regulations must be followed |
| Documentation | Order-specific CoA, chemical composition or impurity data, dimensional inspection, and agreed bonding / assembly records |
Beryllium Sputtering Targets is a composition-specific sputtering target for thin-film deposition and PVD process development. The practical specification normally includes chemistry, purity, dimensions, density, target configuration, and any bonding or backing requirement needed by the sputtering cathode.
Material and Deposition Characteristics
Power mode and process conditions should be selected according to the target conductivity, thermal behavior, and the requirements of the cathode system. For less common materials, conservative initial power density and film-composition verification are good practice.
Technical Data
| Parameter | Typical Value / Range | Importance |
|---|---|---|
| Purity | 99.0% – 99.9% | High purity improves film quality and device performance |
| Density | ≥98% theoretical | Ensures stable sputtering and uniform deposition |
| Diameter | 25 – 300 mm (custom) | Compatible with various sputtering systems |
| Thickness | 3 – 6 mm | Influences sputtering rate and target lifetime |
| Bonding | Copper backing plate (optional) | Improves heat dissipation and structural stability |
| Material | Key Advantage | Typical Application |
|---|---|---|
| Beryllium (Be) | Extremely lightweight with high stiffness | Aerospace and precision optical systems |
| Aluminum (Al) | Good conductivity and low cost | General thin film coatings |
| Titanium (Ti) | Excellent adhesion and corrosion resistance | Protective and structural coatings |
| Question | Answer |
|---|---|
| Can beryllium sputtering targets be customized? | Yes, diameter, thickness, purity, and backing plate bonding options can be customized according to sputtering system requirements. |
| Which sputtering method is recommended for beryllium targets? | DC magnetron sputtering is typically used because beryllium is electrically conductive. |
| Are bonded targets available? | Yes, beryllium targets can be indium-bonded or elastomer-bonded to copper backing plates for improved heat dissipation. |
| What substrates are compatible with beryllium thin films? | Silicon wafers, glass, ceramics, and metal substrates are commonly used depending on the application. |
| Which industries commonly use beryllium sputtering targets? | Aerospace, semiconductor research, X-ray optics manufacturing, and scientific instrumentation industries. |
Typical Thin-Film Applications
- Thin-film research and materials-development projects requiring a composition-specific sputtering source
- Semiconductor, optical, energy, electronic, or laboratory coatings depending on the material system
- Custom R&D work where target composition, purity, and geometry need to be specified together
Target Configuration and Ordering Considerations
For quotation and manufacturability review, provide target size, thickness, purity or alloy composition, quantity, and the sputtering gun or cathode model if known. If a bonded assembly is required, include backing-plate material, bonding preference, and any dimensional tolerances, surface-finish needs, or inspection-document requirements. TFM can also review customer drawings or old-target samples for replacement builds.
Frequently Asked Questions
What is the main reason to use a Berylliums sputtering target?
It provides a composition-specific source for thin-film deposition when the target material itself is important to the desired film chemistry or process.
How should the sputtering mode for Berylliums be selected?
The power mode should be chosen according to target conductivity, thermal behavior, and equipment capability. Less-conductive materials are commonly evaluated with RF power.
Why are density and microstructure important for Berylliums targets?
These factors can influence erosion stability, thermal behavior, particle generation, and the risk of cracking or local hot spots.
Can Berylliums be supplied with a backing plate?
Yes. If the material is brittle or the cathode requires it, a bonded configuration can be reviewed according to target size, thickness, cooling, and power.
Does target composition always equal film composition?
No. Film chemistry may differ because of sputtering yields, process conditions, substrate temperature, re-sputtering, and chamber history. Film verification is recommended when composition matters.
What should I provide to request a quotation for Berylliums?
Please provide the composition, purity, dimensions, quantity, target configuration, cathode details, and any drawing or inspection requirements.
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