Generic selectors
Exact matches only
Search in title
Search in content
Post Type Selectors

ST0273 Bismuth Sulfide Sputtering Target, Bi2S3

Chemical Formula: Bi2S3
Catalog Number: ST0273
CAS Number: 1345-07-9
Purity: 99.9%, 99.95%, 99.99%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Bismuth Sulfide sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

Bismuth Sulfide Sputtering Target

Introduction

The Bismuth Sulfide (Bi₂S₃) Sputtering Target is a compound target material widely used in thin film deposition. Known for its semiconducting and thermoelectric properties, Bi₂S₃ is a promising material for next-generation optoelectronic devices, infrared sensors, and energy conversion technologies. Its ability to form stable thin films with controlled composition makes it an essential choice for both research laboratories and industrial applications.

Detailed Description

Bismuth Sulfide sputtering targets are manufactured from high-purity Bi₂S₃ powders (≥99.9%) using sintering or hot-pressing techniques. These processes ensure:

  • High Purity and Low Contamination: Critical for electronic and optical thin film applications.

  • Uniform Density: Enhances sputtering efficiency and film uniformity.

  • Custom Dimensions: Targets available from 25 mm to 300 mm in diameter, with thicknesses between 3 mm and 6 mm.

  • Bonding Options: Indium, copper, or elastomer bonding improves heat transfer and mechanical stability during sputtering.

Bismuth Sulfide has an orthorhombic crystal structure, a narrow band gap (~1.3 eV), and excellent photoresponse characteristics, making it highly suitable for infrared optoelectronics and photovoltaics.

Applications

Bismuth Sulfide sputtering targets are used in a wide range of applications, including:

  • Optoelectronics: Thin films for photodetectors and IR sensors.

  • Semiconductors: Functional layers in microelectronics and electronic devices.

  • Solar cells: Absorber layers in thin film photovoltaic devices.

  • Thermoelectrics: Thin films for energy conversion systems.

  • Research & Development: Advanced material studies and device prototyping.

Technical Parameters

ParameterTypical Value / RangeImportance
Purity≥99.9% (3N)Ensures low contamination in thin films
Diameter25 – 300 mm (custom)Fits a wide range of sputtering systems
Thickness3 – 6 mmInfluences deposition rate and target lifetime
Density~6.8 g/cm³Supports stable sputtering behavior
BondingIndium, Copper, ElastomerImproves thermal conductivity and target stability

Comparison with Related Materials

MaterialKey AdvantageTypical Application
Bismuth SulfideNarrow bandgap, IR sensitivityOptoelectronics, photovoltaics
Bismuth Oxide (Bi₂O₃)High ionic conductivitySolid electrolytes, sensors
Zinc Sulfide (ZnS)Wide bandgap, optical clarityOptics, protective coatings

FAQ

QuestionAnswer
Can Bi₂S₃ sputtering targets be customized?Yes, dimensions, bonding type, and purity can be tailored.
How are the targets packaged?Each target is vacuum-sealed, cushioned with protective foam, and packed in export-safe cartons or wooden crates.
What industries use Bi₂S₃ targets?Semiconductor, optics, solar energy, and advanced R&D.
Do you supply bonded targets?Yes, bonding with indium, copper, or elastomer is available for enhanced performance.

Packaging

Our Bismuth Sulfide sputtering targets are vacuum-sealed to prevent contamination and moisture absorption. Each target is carefully labeled and packed in sturdy cartons or wooden crates, ensuring safe global shipment.

Conclusion

The Bismuth Sulfide (Bi₂S₃) Sputtering Target is a versatile compound target with excellent optoelectronic and thermoelectric properties. With customizable purity, sizes, and bonding options, it provides reliable performance for thin film deposition in photovoltaics, infrared devices, and semiconductor research.

For detailed specifications and a quotation, please contact us at [sales@thinfilmmaterials.com].

Reviews

There are no reviews yet.

Be the first to review “ST0273 Bismuth Sulfide Sputtering Target, Bi2S3”

Your email address will not be published. Required fields are marked *

Related Products

FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
Shopping Cart
Scroll to Top