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ST0273 Bismuth Sulfide Sputtering Target, Bi2S3

Chemical Formula: Bi2S3
Catalog Number: ST0273
CAS Number: 1345-07-9
Purity: 99.9%, 99.95%, 99.99%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Bismuth Sulfide sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Bismuth Sulfide Sputtering Target Description

Bismuth sulfide sputtering target is a sulfide ceramic sputtering material made from bismuth and sulfur. It is used in various thin film deposition processes and applications, providing unique properties that are beneficial in electronics, photovoltaics, and other industries requiring specialized coatings.

BismuthBismuth is a chemical element that gets its name from the German ‘Bisemutum,’ a corruption of ‘Weisse Masse,’ meaning white mass. It was first utilized in 1753 and discovered by C.F. Geoffroy. The element is represented by the symbol “Bi” and has an atomic number of 83 in the periodic table. Bismuth is located in Period 6 and Group 15, which belongs to the p-block. Its relative atomic mass is 208.98040(1) Dalton, with the number in brackets indicating the measurement uncertainty.

Related Product: Bismuth Sputtering Target

SulfurSulfur, also spelled sulphur, is a chemical element with a rich history of usage dating back to before 2000 BC, discovered by ancient Chinese and Indian civilizations. Its name is derived from either the Sanskrit ‘sulvere’ or the Latin ‘sulfurium,’ both referring to sulfur. The element is symbolized as “S” and has an atomic number of 16 in the periodic table. It is located in Period 3 and Group 16, within the p-block. The relative atomic mass of sulfur is 32.065(5) Dalton, where the number in parentheses indicates the measurement uncertainty.

Bismuth Sulfide Sputtering Target Specification

Compound Formula Bi2S3
Appearance Solid
Density 7.7 g/cm3
Available Sizes Dia.: 1.0″, 2.0″, 3.0″, 4.0″, 5.0″, 6.0″
Thick: 0.125″, 0.250″

Bismuth Sulfide Sputtering Target Application

The bismuth sulfide sputtering target is utilized in various applications including thin film deposition, decoration, semiconductor manufacturing, display technologies, LED and photovoltaic devices, and functional coatings. It is also commonly used in industries related to optical information storage, glass coatings for automotive and architectural purposes, and optical communication technologies.

Bismuth Sulfide Sputtering Target Packing

Our bismuth sulfide sputter targets are carefully tagged and labeled externally to ensure efficient identification and maintain high standards of quality control. We take great care in handling and packaging these targets to prevent any damage that could occur during storage or transportation, ensuring they reach you in perfect condition.

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TFM offers Bismuth Sulfide  Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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