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Bismuth Sputtering Target

ST0004 Bismuth Sputtering Target, Bi

Chemical Formula: Bi
Catalog Number: ST0004
CAS Number: 7440-69-9
Purity: ＞99.9%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Bismuth Sputtering Targets come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Bismuth Sputtering Target Description

BismuthBismuth sputtering targets share the same properties as metallic bismuth. Bismuth (Bi), with an atomic number of 83, is a chemical element named from the German ‘Bisemutum,’ derived from ‘Weisse Masse,’ meaning white mass. Located in Period 6, Group 15 of the periodic table, it is the most metallic and least abundant in the nitrogen group. Bismuth is hard, brittle, lustrous, and coarsely crystalline, distinguishable by its unique gray-white color with a reddish hue. Bismuth sputtering targets are widely used in aerospace, automotive lighting, OLED, and optical industries.

Bismuth Sputtering Target Specification

Material TypeBismuth
SymbolBi
Color/AppearanceLustrous Reddish White, Metallic
Melting Point2079 °C
Boiling Point1560 °C
Density9.747 g/cm3
SputterRF
Type of BondIndium, Elastomer
CommentsResistivity high. Low Melting Point materials not ideal for sputtering.
Available SizesDia.: 2.0″, 3.0″, 4.0″, 5.0″, 6.0″
Thick: 0.125″, 0.250″

We also offer other customized shapes and sizes of the sputtering targets; please Contact Us for more information.

Bismuth Sputtering Target Application

Bismuth sputter targets are used for thin film deposition in applications such as fuel cells, decorative coatings, semiconductors, displays, LEDs, photovoltaic devices, and glass coatings. Other uses of bismuth include:

  • Fusible alloys
  • Cosmetics and pigments
  • Low melting solders
  • Pharmaceuticals
  • Lead replacement
  • Synthetic fibers
  • Shot and shotgun pellets

Bismuth Sputtering Target Bonding Services

Specialized bonding services for Bismuth Sputtering Targets, including indium and elastomeric bonding techniques, enhance performance and durability. Thin Film Materials (TFM) ensures high-quality solutions that meet industry standards and customer needs.

We also offer custom machining of backing plates, which is essential for sputtering target assembly. This comprehensive approach improves target design flexibility and performance in thin film deposition. Our channels provide detailed information about bonding materials, methods, and services, helping clients make informed decisions.

 

Bismuth Sputtering Target Packaging

Our Bismuth Sputtering Targets are clearly tagged and labeled externally to ensure efficient identification and quality control. We take great care to prevent any damage during storage and transportation.

Get Contact

TFM offers Bismuth Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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Bi Target 4N ø50.8*3mm Indium Bonded 3mm Cu B/Plate, Bi Target 4N ø50.8*6mm Indium Bonded 3mm Cu B/Plate

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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