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Bismuth Yttrium Iron Garnet (BiY₂Fe₅O₁₂) Sputtering Target

Bismuth Yttrium Iron Garnet (BiY₂Fe₅O₁₂) Sputtering Target

Overview
Bismuth Yttrium Iron Garnet (Bi:YIG), with the chemical formula BiY₂Fe₅O₁₂, is a magnetic garnet material known for its exceptional magneto-optical properties. By partially substituting Yttrium with Bismuth in YIG (Yttrium Iron Garnet), Bi:YIG exhibits an increased Verdet constant, making it highly efficient in Faraday rotation applications across the visible and near-infrared spectrum.

Key Properties

  • Chemical Formula: BiY₂Fe₅O₁₂

  • Crystal Structure: Cubic garnet

  • High Verdet Constant: Enhanced Faraday rotation efficiency compared to pure YIG

  • Optical Transparency: High transmission in visible and near-IR wavelengths

  • Magnetic Softness: Low coercive force and low magnetic loss

  • Thermal Stability: Suitable for high-temperature and long-term use

Typical Applications

  • Optical Isolators – Prevent back reflections in laser and fiber optic systems

  • Optical Circulators – Enable directional light control in photonic circuits

  • Magneto-Optical Modulators – For laser modulation and signal processing

  • Spintronics – Research on magnonics and spin wave devices

  • Thin Film Research – Deposition of magneto-optical coatings for integrated optics

Example Specification

  • Material: Bismuth Yttrium Iron Garnet (BiY₂Fe₅O₁₂)

  • Purity: ≥ 99.9%

  • Size: Ø50.8 × 6.35 mm

  • Bonding: Copper backing plate Ø50.8 × 2.54 mm, total thickness < 8.89 mm

  • Deposition Method: RF Magnetron Sputtering

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BiY₂Fe₅O₁₂ Target ø50.8*6.35mm Bonded to Cu B/Plate (ø50.8*2.54mm)

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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