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Bismuth Yttrium Iron Garnet (BiY₂Fe₅O₁₂) Sputtering Target

Bismuth Yttrium Iron Garnet (BiY₂Fe₅O₁₂) Sputtering Target

Introduction

Bismuth Yttrium Iron Garnet (BiY₂Fe₅O₁₂), commonly referred to as Bi:YIG, is a magneto-optical garnet material renowned for its exceptionally large Faraday rotation and low optical loss. As a sputtering target, BiY₂Fe₅O₁₂ enables the deposition of high-quality magneto-optical thin films essential for photonics, integrated optics, and spintronic research.

Detailed Description

BiY₂Fe₅O₁₂ is a bismuth-substituted yttrium iron garnet with a cubic garnet crystal structure. Partial substitution of yttrium by bismuth significantly enhances magneto-optical activity while preserving magnetic ordering and optical transparency in the visible to near-infrared range.

Our BiY₂Fe₅O₁₂ sputtering targets are produced using high-purity oxide precursors followed by controlled solid-state reaction, calcination, and high-temperature sintering. This process ensures:

  • Single-phase garnet structure, minimizing parasitic phases

  • High density and homogeneous microstructure, enabling stable sputtering

  • Reliable stoichiometric transfer, critical for magneto-optical film performance

Targets are available as monolithic ceramic discs or bonded to metallic backing plates (typically copper) to improve thermal conductivity and mechanical integrity during sputtering.

Applications

Bismuth Yttrium Iron Garnet sputtering targets are widely used in:

  • Magneto-optical isolators and circulators

  • Optical modulators and integrated photonic devices

  • Spintronic and magnonic thin-film research

  • Magnetic field sensing and imaging

  • Advanced research on garnet-based functional oxides

Technical Parameters

ParameterTypical Value / RangeImportance
Chemical FormulaBiY₂Fe₅O₁₂Defines magneto-optical behavior
Crystal StructureGarnetEnables Faraday rotation effects
Purity99.9% – 99.99%Reduces optical loss and defects
Diameter25 – 300 mm (custom)Compatible with standard sputter guns
Thickness3 – 6 mmEnsures sputtering stability
Density≥ 95% theoreticalImproves film uniformity
BondingOptional Cu backing plateEnhances heat dissipation

Comparison with Related Garnet Materials

MaterialKey AdvantageTypical Application
BiY₂Fe₅O₁₂ (Bi:YIG)Very high Faraday rotationMagneto-optical devices
Y₃Fe₅O₁₂ (YIG)Low magnetic dampingMicrowave & spintronics
Ce:YIGStrong MO response at telecom wavelengthsOptical isolators

FAQ

QuestionAnswer
Can the Bi content be adjusted?Yes, bismuth substitution levels can be customized upon request.
Is RF sputtering required?RF sputtering is typically recommended for ceramic garnet targets.
Can the target be bonded?Yes, bonding to copper backing plates is available.
Is this suitable for research use?Yes, BiY₂Fe₅O₁₂ targets are widely used in academic and industrial R&D.

Packaging

Our Bismuth Yttrium Iron Garnet Sputtering Targets are individually labeled and vacuum-sealed to ensure traceability and contamination-free delivery. Protective packaging is used to prevent mechanical damage during storage and international transportation.

Conclusion

Bismuth Yttrium Iron Garnet (BiY₂Fe₅O₁₂) Sputtering Targets provide a reliable foundation for depositing high-performance magneto-optical thin films. With controlled composition, high density, and customizable formats, they are well suited for cutting-edge photonic and magnetic research.
For detailed specifications and a quotation, please contact us at sales@thinfilmmaterials.com.*

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BiY₂Fe₅O₁₂ Target ø50.8*6.35mm Bonded to Cu B/Plate (ø50.8*2.54mm)

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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