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VD0537A BixSb1-xTe Pellet Evaporation Material

MSDS File
Material TypeBixSb1-xTe
SymbolBixSb1-xTe
Melting Point (°C)
Theoretical Density (g/cc)
Z Ratio
E-Beam
E-Beam Crucible Liner Material
Temp. (°C) for Given Vap. Press. (Torr)
Comments

BixSb1-xTe Pellet Evaporation Material

TFM offers high-purity BixSb1-xTe Pellet Evaporation Material, a key compound for thermoelectric applications, thin-film deposition, and semiconductor research. Known for its exceptional thermoelectric properties, this material is widely utilized in energy conversion devices, infrared sensors, and advanced electronic components.

Key Features and Advantages

  • High Purity (99.99% – 99.999%) – Ensures optimal performance in thin-film deposition and thermoelectric applications.

  • Thermoelectric Efficiency – Provides high thermoelectric power factor for energy conversion devices.

  • Optimized for Thin-Film Deposition – Ideal for thermal evaporation and E-beam evaporation techniques.

  • Stable & Uniform Coating – Delivers consistent coating quality, critical for high-performance thermoelectrics.

  • Customizable Composition – The Bi/Sb ratio can be modified to tailor the thermoelectric properties for specific applications.

Applications

  • Thermoelectric Generators – Used in energy harvesting and conversion for power generation.

  • Infrared Sensors – Applied in thermal imaging and infrared detection.

  • Thin-Film Solar Cells – Enhances photovoltaic devices by providing thermoelectric effects.

  • Semiconductor Research – Supports material science studies for advanced electronic components.

Industry Impact

TFM’s BixSb1-xTe Pellet Evaporation Material is a high-performance material that plays a pivotal role in thermoelectric energy conversion, infrared sensing, and semiconductor research. With its exceptional thermoelectric properties, high purity, and optimized deposition characteristics, it is an ideal choice for cutting-edge energy solutions and advanced material science applications.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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