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VD0538 Boron (B) Evaporation Materials

Material Type：Boron
Symbol：B
Color/Appearance：Black, Semi-metallic
Purity：99.5%
Shape：Powder/ Granule/ Custom-made

TFM is a leading provider of high-purity Boron Evaporation Materials, offering a comprehensive selection of evaporation materials in various forms. Our product range includes powders, granules, and custom-shaped options tailored to specific needs. As a prominent manufacturer and supplier, we are dedicated to delivering exceptional quality and versatility in all our evaporation materials.

MSDS File

Boron Evaporation Materials Description

For successful deposition processes, the quality of evaporated films depends significantly on the purity of the materials used. TFM offers top-grade boron evaporation materials, renowned for their impressive purity levels reaching up to 99.5%. This high-purity boron is meticulously crafted to meet demanding standards, ensuring consistent and reliable performance. TFM’s rigorous quality control measures are key to delivering materials that you can trust for superior film deposition results.

boron evaporation materials

Barium Evaporation Materials Specification

Material TypeBoron
SymbolB
Color/AppearanceBlack, Semi-metallic
Melting Point271.3 °C
Boiling Point2550 °C
Density2.34 cryst. g/cm3
Thermal Conductivity27 W/m.K

Barium Evaporation Materials Applications

Boron evaporation materials are widely utilized in various deposition processes, including semiconductor deposition, Chemical Vapor Deposition (CVD), and Physical Vapor Deposition (PVD). In the field of optics, these materials play a crucial role in applications like wear protection, decorative coatings, and display technologies. Their versatility and high purity make them essential for achieving precise and durable results in these advanced technological applications.

Barium Evaporation Materials Packaging

We take great care in handling our evaporation pellets to prevent any damage during storage and transportation. This meticulous approach ensures that the pellets maintain their original quality and are ready for optimal performance when they reach you.

Ordering Table 

Material No. per Pack Size Purity Part Number
Boron 50 grams 3mm - 8mm Pieces 99.5% EVMBX3-8MMB
Boron 100 grams 3mm - 8mm Pieces 99.5% EVMBX3-8MMD
Boron 100 grams Approx 3mm Pieces 99.5% EVMBX253MMD

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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