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VD0539B Cadmium Antimony Pellet Evaporation Material (CdSb)

MSDS File
Material TypeCadmium Antimony
SymbolCdSb
Melting Point (°C)
Theoretical Density (g/cc)
Z Ratio
E-Beam
E-Beam Crucible Liner Material
Temp. (°C) for Given Vap. Press. (Torr)
Comments

Cadmium Antimony Pellet Evaporation Material

TFM provides high-purity Cadmium Antimony Pellet Evaporation Material, a valuable compound for thin-film deposition, optoelectronics, and semiconductor applications. Known for its outstanding optical and electrical properties, this material is extensively used in photovoltaic cells, infrared sensors, and advanced electronic devices.

Key Features and Advantages

  • High Purity (99.99% – 99.999%) – Guarantees optimal performance in thin-film deposition and electronic applications.

  • Excellent Optical & Electrical Properties – Ensures high absorption efficiency for solar cells and optoelectronic devices.

  • Optimized for Thin-Film Deposition – Compatible with thermal evaporation and E-beam evaporation processes.

  • Stable & Uniform Coating – Delivers consistent film quality, which is critical for high-efficiency devices.

  • Customizable Composition – The Cd/Sb ratio can be adjusted to meet specific application requirements.

Applications

  • Thin-Film Solar Cells – Ideal for enhancing solar energy conversion in photovoltaic technologies.

  • Optoelectronic Devices – Used in infrared detectors, photodetectors, and LEDs.

  • Semiconductor Research & Development – Supports cutting-edge material science in the electronics industry.

  • Thin-Film Transistors & Sensors – Applied in wearable electronics, transparent electronics, and smart devices.

Industry Impact

TFM’s Cadmium Antimony Pellet Evaporation Material is a high-performance material that plays a key role in advancements in solar energy, optoelectronics, and semiconductor technologies. Its high purity, superior light absorption, and optimized deposition characteristics ensure high-quality films, making it an ideal choice for renewable energy applications and innovative electronic device fabrication.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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