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VD0539A Cadmium Arsenic Pellet Evaporation Material (Cd2As2)

MSDS File
aterial TypeCadmium Arsenic
SymbolCd2As2
Melting Point (°C)721
Theoretical Density (g/cc)6.21
Z Ratio
E-Beam
E-Beam Crucible Liner Material
Temp. (°C) for Given Vap. Press. (Torr)
Comments

Cadmium Arsenic Pellet Evaporation Material

TFM offers high-purity Cadmium Arsenic Pellet Evaporation Material, a critical compound for thin-film deposition, optoelectronics, and semiconductor applications. Known for its excellent optical and electrical properties, this material is widely used in photovoltaic cells, infrared detectors, and advanced electronic devices.

Key Features and Advantages

  • High Purity (99.99% – 99.999%) – Ensures optimal performance in thin-film deposition and semiconductor applications.

  • Excellent Optical & Electrical Properties – Provides superior light absorption and conductivity, ideal for solar cells and optoelectronic applications.

  • Optimized for Thin-Film Deposition – Compatible with thermal evaporation and E-beam evaporation techniques.

  • Stable & Uniform Coating – Ensures consistent film quality, essential for high-efficiency devices.

  • Customizable Composition – The Cd/As ratio can be adjusted for specific industrial and research requirements.

Applications

  • Thin-Film Solar Cells – Used in photovoltaic applications to enhance solar energy conversion efficiency.

  • Optoelectronic Devices – Ideal for infrared detectors, photodetectors, and LEDs.

  • Semiconductor Research – Supports material science studies for next-generation electronic devices.

  • Thin-Film Transistors & Sensors – Applied in wearable electronics and transparent electronics.

Industry Impact

TFM’s Cadmium Arsenic Pellet Evaporation Material is a high-performance material with exceptional optical and electrical properties, making it ideal for photovoltaics, optoelectronics, and advanced semiconductor applications. Its high purity and optimized deposition characteristics ensure superior film quality, driving innovations in renewable energy and advanced electronics.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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