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cadmium-fluoride

VD0774 Cadmium Fluoride Evaporation Materials, CdF2

Catalog No.VD0774
MaterialCadmium Fluoride (CdF2)
Purity99.9% ~ 99.99%
ShapePowder/ Granule/ Custom-made

TFM is a trusted manufacturer and supplier of high-purity Cadmium Fluoride evaporation materials, along with a diverse range of other evaporation materials. We provide these materials in powder and granule forms, ensuring quality and reliability in deposition processes. Customized forms are also available to meet specific requirements.

MSDS File
Overview of Cadmium Fluoride Evaporation Materials

TFM offers high-purity Cadmium Fluoride (CdF2) evaporation materials, a type of fluoride ceramic widely used in deposition processes. With purity levels reaching up to 99.9995%, these materials are critical for ensuring the high quality of thin-film coatings. TFM focuses on producing evaporation materials that meet stringent quality standards, making them reliable for demanding applications.

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Cadmium Fluoride Evaporation Materials Specification

Material TypeCadmium Fluoride
SymbolCdF2
Appearance/ColorWhite, crystalline solid
Melting Point1,110 °C (2,030 °F; 1,380 K)
Density6.33 g/cm3, solid
Purity99.9% ~ 99.99%
ShapePowder/ Granule/ Custom-made

Applications of Cadmium Fluoride Evaporation Materials

These materials are commonly used in various deposition methods such as semiconductor deposition, chemical vapor deposition (CVD), and physical vapor deposition (PVD). Due to their optical properties, they are essential for applications including:

  • Wear protection
  • Decorative coatings
  • Display technologies

Packaging and Handling

Cadmium Fluoride evaporation materials are carefully packaged to maintain quality and prevent damage during transportation and storage. Every package is clearly labeled for easy identification, ensuring smooth handling throughout the supply chain.

Contact TFM for Custom Solutions

TFM is a trusted supplier of high-purity Cadmium Fluoride evaporation materials, available in various shapes like tablets, granules, rods, and wires. We also offer custom forms and quantities based on your specific needs. Additionally, TFM provides evaporation sources, crucibles, heaters, and e-beam crucible liners. For pricing and additional product information, please contact us directly.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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