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cadmium-sulfide

VD0813 Cadmium Sulfide Evaporation Materials, CdS

Catalog No.VD0813
MaterialCadmium Sulfide (CdS)
Purity99.9% ~ 99.999%
ShapePowder/ Granule/ Custom-made

TFM stands out as a premier producer and supplier of top-quality cadmium sulfide evaporation materials, alongside an extensive range of other evaporation materials. Our offerings come in both powder and granule forms to meet diverse needs. Additionally, we provide customized solutions tailored to specific requirements, ensuring optimal performance and versatility for your applications.

MSDS File

Cadmium Sulfide Evaporation Materials Overview

Cadmium sulfide (CdS) evaporation materials from TFM are high-purity ceramics designed for precise deposition processes. With a chemical composition of CdS, these materials are essential for producing high-quality thin films in various applications. TFM excels in manufacturing these materials with a purity of up to 99.9995%, ensuring top-tier reliability and performance.

Cadmium Sulfide Evaporation Materials Specification

Material TypeCadmium sulfide
SymbolCdS
Appearance/ColorYellow-orange to brown solid.
Melting Point1,750 °C (3,180 °F; 2,020 K) 10 MPa
Density4.826 g/cm3
Purity99.9% ~ 99.999%
ShapePowder/ Granule/ Custom-made

Applications

Cadmium sulfide evaporation materials are versatile and used in a variety of deposition techniques including:

  • Semiconductor Deposition
  • Chemical Vapor Deposition (CVD)
  • Physical Vapor Deposition (PVD)

These materials are particularly useful in optics, serving purposes such as:

  • Wear Protection
  • Decorative Coatings
  • Display Technologies

Packaging and Handling

To ensure quality and prevent damage, cadmium sulfide evaporation materials are carefully packaged with clear labeling for easy identification. This meticulous approach extends through storage and transportation to maintain the material’s integrity.

Contact Us

TFM is a leading provider of high-purity cadmium sulfide evaporation materials. We offer various forms including tablets, granules, rods, and wires, with options for custom shapes and quantities. Additionally, TFM supplies evaporation sources, boats, filaments, crucibles, heaters, and e-beam crucible liners. For pricing information or to request materials not listed, please reach out to us directly.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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