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ST0411 Calcium Oxide Sputtering Target, CaO

Chemical Formula: CaO
Catalog Number: ST0411
CAS Number: 1305-78-8
Purity: 99.9%, 99.95%, 99.99%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Calcium Oxide sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Calcium Oxide Sputtering Target Description

Calcium Oxide structure

Calcium Oxide is a widely used chemical compound. It is a white, caustic, alkaline, crystalline solid at room temperature. The broadly used term “lime” connotes calcium-containing inorganic materials, in which carbonates, oxides, and hydroxides of calcium, silicon, magnesium, aluminum, and iron predominate. In contrast, “quicklime” specifically refers to the single chemical compound calcium oxide.

Related Products: Calcium Sputtering Target

Manufacturing Process
  • Manufacturing
    • Cold Pressing: High-purity materials are formed into the desired shape and size by cold pressing.
    • Sintering: The pressed materials are sintered at high temperatures to increase density and mechanical strength.
    • Elastomer Bonding: The sintered target is elastomer-bonded to a backing plate for enhanced stability and durability during use.
  • Cleaning and Final Packaging
    • Cleaning: The sputtering targets are meticulously cleaned to ensure they are suitable for vacuum environments and free from contaminants.
    • Protection from Environmental Contaminants: Steps are taken to safeguard the targets from environmental contaminants that could affect their performance.
    • Protection During Shipment: The targets are carefully packaged to prevent any damage during transportation, ensuring they arrive in perfect condition for use.

Calcium Oxide Sputtering Target Specification

Material TypeCalcium Oxide
SymbolCaO
Color/AppearanceWhite Target
Melting Point 2,572° C(4,662° F)
SputterRF-R
Density3.3 g/cm3

Packing

Our calcium oxide sputtering target is clearly tagged and labeled externally to ensure efficient identification and quality control. Great care is taken to avoid any damage that might occur during storage or transportation, ensuring the product arrives in perfect condition.

Get Contact

TFM offers Calcium Oxide Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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