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ST0337 Calcium Ruthenate Sputtering Target, CaRuO3

Chemical Formula:CaRuO3
Catalog Number: ST0337
CAS Number:
Purity:99.90%
Shape:Discs, Plates, Step Targets, Custom-made

 Calcium Ruthenate sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

Introduction

Calcium Ruthenate (CaRuO₃) Sputtering Target is a conductive perovskite oxide material widely used in advanced oxide electronics and functional thin film research. As a member of the ABO₃ perovskite family, CaRuO₃ exhibits metallic conductivity, strong structural compatibility with other perovskite oxides, and excellent chemical stability.

CaRuO₃ sputtering targets are particularly valuable as bottom electrodes, buffer layers, and conductive oxide components in complex oxide heterostructures, ferroelectric devices, and spintronic systems. Their structural and electronic compatibility with oxide materials makes them a preferred choice in epitaxial thin film growth.


Detailed Description

Calcium Ruthenate (CaRuO₃) crystallizes in an orthorhombic perovskite structure and is known for its metallic-like electrical conductivity and paramagnetic behavior. Unlike many oxide materials, CaRuO₃ maintains relatively low resistivity while preserving structural stability under high-temperature deposition conditions.

High-quality CaRuO₃ sputtering targets are typically fabricated through solid-state reaction or advanced ceramic processing routes, followed by hot pressing or sintering to achieve high density (≥ 95–99% of theoretical density). Proper phase control is critical to ensure single-phase perovskite structure and prevent secondary oxide formation.

Key material characteristics include:

  • Metallic conductivity among perovskite oxides

  • Strong lattice matching with SrTiO₃, LaAlO₃, and other perovskite substrates

  • Chemical stability in oxygen-rich deposition environments

  • Excellent compatibility as an electrode layer

Due to its ceramic and oxide nature, CaRuO₃ is commonly sputtered using RF magnetron sputtering or pulsed DC sputtering in oxygen or mixed Ar/O₂ atmospheres. Precise oxygen partial pressure control during deposition is essential to preserve stoichiometry and optimize film conductivity.

Available target configurations include:

  • Planar round targets (1″–6″ and larger custom sizes)

  • Rectangular targets for large-area coating systems

  • Bonded configurations for enhanced thermal management (when required)


Applications

Calcium Ruthenate sputtering targets are widely used in:

  • Oxide Electronics – Conductive oxide electrodes

  • Ferroelectric Devices – Bottom electrodes for PZT and related films

  • Spintronics Research – Functional oxide heterostructures

  • Superconducting & Quantum Materials Research – Perovskite thin film studies

  • MEMS & Microelectronics – Stable conductive oxide layers

  • Thin Film Capacitors – High-performance electrode materials

CaRuO₃ is especially attractive in epitaxial growth systems where lattice compatibility and chemical stability are crucial.


Technical Parameters

ParameterTypical Value / RangeImportance
Purity≥ 99.9% (oxide basis typical)Ensures phase purity and stable electrical behavior
Phase StructureSingle-phase PerovskiteCritical for predictable film properties
Density≥ 95–99% of theoreticalReduces arcing and ensures stable sputtering
Diameter25 – 150 mm (custom available)Compatible with sputtering systems
Thickness3 – 6 mm (typical)Influences target lifetime
Sputtering MethodRF / Pulsed DCSuitable for oxide ceramic targets

Comparison with Related Materials

MaterialKey AdvantageTypical Application
CaRuO₃Conductive perovskite with strong lattice matchingOxide electrodes
SrRuO₃Ferromagnetic perovskite conductorSpintronic devices
LaNiO₃Metallic oxide with high conductivityTransparent electrodes
IrO₂Excellent chemical stabilityElectrochemical electrodes

Compared to SrRuO₃, CaRuO₃ offers paramagnetic behavior and distinct electronic properties, making it suitable for specific oxide heterostructure designs.


FAQ

QuestionAnswer
Can the CaRuO₃ composition be customized?Yes, slight stoichiometric adjustments and dimensions can be tailored based on deposition requirements.
Is RF sputtering required?Yes, RF magnetron sputtering is typically used for oxide ceramic targets.
Does oxygen flow need to be controlled?Yes, maintaining appropriate oxygen partial pressure is essential to ensure film stoichiometry and conductivity.
What substrates are compatible?SrTiO₃, LaAlO₃, NdGaO₃, and other perovskite-type substrates.
How is the target packaged?Vacuum-sealed packaging with protective cushioning and export-grade cartons or wooden crates.

Packaging

Our Calcium Ruthenate Sputtering Targets are meticulously tagged and labeled externally to ensure efficient identification and maintain high standards of quality control. We take great care to prevent any potential damage during storage and transportation, ensuring the targets arrive in perfect condition.


Conclusion

Calcium Ruthenate (CaRuO₃) Sputtering Targets provide a reliable and structurally compatible solution for conductive oxide thin film deposition. With high phase purity, dense microstructure, and excellent lattice matching characteristics, CaRuO₃ supports advanced research and industrial applications in oxide electronics and functional materials.

For detailed specifications and a quotation, please contact us at sales@thinfilmmaterials.com.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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