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Calcium Sulfide Evaporation Materials

VD0814 Calcium Sulfide Evaporation Materials, CaS

Catalog No.VD0814
MaterialCalcium Sulfide (CaS)
Purity99.9% ~ 99.95%
ShapePowder/ Granule/ Custom-made

TFM stands out as a top-tier manufacturer and provider of premium calcium sulfide evaporation materials. Our offerings include both powder and granule forms of these materials, and we also accommodate customized requests to meet specific needs. Whether you require standard or tailored solutions, TFM delivers high-quality evaporation materials that ensure exceptional performance.

MSDS File
Calcium Sulfide Evaporation Materials Overview

TFM’s calcium sulfide (CaS) evaporation materials are high-purity ceramic products essential for various deposition processes. With a chemical formula of CaS, these materials are critical for achieving superior film quality during deposition. TFM excels in manufacturing calcium sulfide evaporation materials with purity levels reaching up to 99.9995%, ensuring reliability through rigorous quality assurance procedures.

Product Specifications

Material TypeCalcium sulfide
SymbolCaS
Appearance/ColorWhite crystals
Melting Point1,750 °C (3,180 °F; 2,020 K) 10 MPa
Density4.826 g/cm3
Purity99.9% ~ 99.999%
ShapePowder/ Granule/ Custom-made

Applications

Our calcium sulfide evaporation materials are employed in various deposition techniques including semiconductor deposition, chemical vapor deposition (CVD), and physical vapor deposition (PVD). They are widely used in optics for applications such as wear protection, decorative coatings, and display technologies.

Packaging and Quality Assurance

Each batch of calcium sulfide evaporation materials is meticulously tagged and labeled for clear identification and quality control. We ensure that our products are well-protected during storage and transport to prevent any damage.

Contact Us

TFM provides an extensive range of calcium sulfide evaporation materials in different shapes including tablets, granules, rods, and wires. Custom forms and quantities are also available to meet specific requirements. In addition to evaporation materials, TFM offers evaporation sources, boats, filaments, crucibles, heaters, and e-beam crucible liners. For current pricing and inquiries on materials not listed, please reach out to us directly.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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