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ST0018 Carbon Graphite Sputtering Target, C

Chemical Formula: C
Catalog Number: ST0018
CAS Number: 7782-42-5
Purity: 99.99%, 99.999%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Carbon Graphite Sputtering Targets come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Availability: 1 in stock

Carbon Graphite Sputtering Target Description

Carbon

The carbon graphite sputtering target is a black, non-metallic target made of high-purity carbon graphite. Carbon graphite is one of three natural forms of elemental carbon, alongside diamond and coal. Carbon (C) derives its name from the Latin word ‘carbo,’ meaning charcoal, and was first used around 3750 BC by Egyptians and Sumerians. The chemical symbol for carbon is “C,” and it has an atomic number of 6, located in Period 2, Group 14 of the periodic table, within the p-block. The relative atomic mass of carbon is 12.0107(8) Dalton, with the number in brackets indicating uncertainty.

Carbon Graphite Sputtering Target Specification

Material TypeCarbon
SymbolC
Color/AppearanceBlack, Non-Metallic
Melting Point3652 – 3697 °C
Boiling Point4200 °C
Density2.267 g/cm3
Thermal Conductivity140 W/m.K
Coefficient of Thermal Expansion7.1 x 10-6/K
CommentsE-beam preferred. Arc evaporation. Poor film adhesion.
Available SizesDia.: 1.0″, 2.0″, 3.0″, 4.0″, 5.0″, 6.0″
Thick: 0.125″, 0.250″

We also offer other customized shapes and sizes of the sputtering targets; please Contact Us for more information.

Carbon Graphite Sputtering Target Application

The carbon graphite sputtering target is used for thin film deposition in applications such as decoration, semiconductors, displays, LEDs, photovoltaic devices, functional coatings, optical information storage, glass coatings (including car and architectural glass), and optical communication.

Carbon’s applications include:

  • Alloying with iron to manufacture steel
  • Brushes in electrical generators and motors
  • Coating surfaces like glass with colloidal graphite or carbon
  • Absorbing microwaves and inhibiting photoelectrons and secondary electrons in electrical assemblies
  • Using high-purity carbon (graphite) in nuclear reactors to moderate neutrons

Carbon Graphite Sputtering Target Bonding Service

Specialized bonding services for Carbon Graphite Sputtering Targets, including indium and elastomeric bonding techniques, enhance performance and durability. Thin Film Materials (TFM) ensures high-quality solutions that meet industry standards and customer needs.

We also offer custom machining of backing plates, which is essential for sputtering target assembly. This comprehensive approach improves target design flexibility and performance in thin film deposition. Our channels provide detailed information about bonding materials, methods, and services, helping clients make informed decisions.

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Carbon Graphite Sputtering Target Packaging

Our Carbon Graphite Sputter Targets are clearly tagged and labeled externally to ensure efficient identification and quality control. We take great care to prevent any damage during storage and transportation.

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TFM offers Carbon Graphite Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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