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ST0291 Cerium Boride Sputtering Target, CeB6

Chemical Formula: CeB6
Catalog Number: ST0291
CAS Number: 12008-02-5
Purity: >99.9%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Cerium Boride  sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Cerium Boride Sputtering Target Description

A Cerium Boride Sputtering Target is a ceramic material composed of cerium and boron, used in sputtering processes. This type of target is commonly utilized in thin film deposition and other specialized applications due to its unique material properties.

CeriumCerium is a chemical element named after Ceres, the Roman goddess of agriculture. It was first identified in 1803 by scientists Martin Heinrich Klaproth, Jöns Jacob Berzelius, and Wilhelm Hisinger. The element was later isolated and its properties announced by Carl Gustaf Mosander. Cerium is represented by the symbol “Ce” and has an atomic number of 58. It is located in Period 6 and Group 3 of the periodic table, belonging to the f-block. The relative atomic mass of cerium is approximately 140.116 Daltons, with the number in parentheses indicating a margin of uncertainty.

Related Product: Cerium Sputtering Target

BoronBoron is a chemical element with the symbol “B” and an atomic number of 5. The name “boron” derives from the Arabic word ‘buraq,’ referring to borax. The element was first identified in 1808 by scientists Louis-Joseph Gay-Lussac and Louis-Jacques Thénard. The isolation of boron was later achieved and announced by Sir Humphry Davy. Boron is located in Period 2 and Group 13 of the periodic table, classified under the p-block elements. Its relative atomic mass is approximately 10.811 Daltons, with the value in parentheses indicating a margin of uncertainty.

Cerium Boride Sputtering Target Application

The Cerium Boride Sputtering Target is utilized in a variety of applications, including thin film deposition and decorative coatings. It is commonly used in the semiconductor industry, display technologies, LED and photovoltaic device manufacturing, and functional coatings. Additionally, it plays a significant role in the optical information storage industry, glass coatings for automotive and architectural purposes, and optical communication technologies.

Cerium Boride Sputtering Target Packing

Our Cerium Boride Sputtering Targets are clearly tagged and labeled externally to facilitate easy identification and uphold stringent quality control measures. We take great care to protect these targets from damage during storage and transportation, ensuring they arrive in excellent condition.

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TFM offers Cerium Boride Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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