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VD0541 Cerium (Ce) Evaporation Materials

TFM is a leading provider of high-purity cerium evaporation materials, offering a broad range of evaporation products. We specialize in delivering cerium materials in various forms, including powder, granules, and custom shapes tailored to your specific needs. Our extensive selection ensures that we can meet diverse requirements for different applications.

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Cerium Evaporation Materials Description

High-purity cerium evaporation materials are essential for producing high-quality deposited films in various deposition processes. TFM specializes in manufacturing cerium evaporating materials with purity levels reaching up to 99.95%. Our strict quality assurance measures ensure the reliability and consistency of these materials, making them ideal for demanding applications.

cerium evaporation materials

Cerium Evaporation Materials Specification

Material TypeCerium
SymbolCe
Color/AppearanceSilvery White, Metallic
Melting Point798°C
Density~6.70g/cc
Thermal Conductivity1 W/m.K
Coefficient of Thermal Expansion6.3 x 10-6/K

Cerium Evaporation Materials Applications

Cerium evaporation materials are utilized in several deposition processes, such as semiconductor deposition, Chemical Vapor Deposition (CVD), and Physical Vapor Deposition (PVD). They are also employed in optics for applications like wear protection, decorative coatings, and display technologies.

Cerium Evaporation Materials Packaging

We handle our cerium evaporation pellets with utmost care to avoid any damage during storage and transportation, ensuring that their quality is maintained in their original condition.

Ordering Table 

VD0541 Cerium (Ce) Evaporation Materials

Material Size Quantity Purity Part Number
Cerium 1mm - 3mm Pieces 50 g 99.9% EVMCEX1-3MMB
Cerium 2mm - 6mm Pieces 25g 99.9% EVMCEX2-6MMA
Cerium 2mm - 6mm Pieces 250 g 99.9% EVMCEX2-6MMJ

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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