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ST0069 Cerium Gadolinium Sputtering Target, Ce/Gd

Chemical Formula: Ce/Gd
Catalog Number: ST0069
CAS Number: 7440-45-1 | 7440
Purity: 99.9%, 99.95%, 99.99%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Cerium Gadolinium sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Cerium Gadolinium Sputtering Target Description

The cerium gadolinium sputtering target from TFM is a silvery alloy sputtering material composed of cerium (Ce) and gadolinium (Gd).

Cerium

Cerium:

Cerium is a chemical element named after Ceres, the Roman goddess of agriculture. It was first mentioned in 1803 and observed by H. Klaproth, J. Berzelius, and W. Hisinger. The isolation of cerium was later accomplished and announced by G. Mosander. The chemical symbol for cerium is “Ce,” and it has the atomic number 58. Cerium is located in Period 6 and Group 3 of the periodic table, within the f-block. The relative atomic mass of cerium is 140.116(1) Dalton, with the number in brackets indicating the uncertainty.

Related Product: Cerium Sputtering Target

GadoliniumGadolinium is a chemical element that originated from Johan Gadolin, chemist, physicist and mineralogist. It was first mentioned in 1880 and observed by J. C. G. de Marignac. The isolation was later accomplished and announced by F. L. de Boisbaudran. “Gd” is the canonical chemical symbol of gadolinium. Its atomic number in the periodic table of elements is 64 with a location at Period 6 and Group 3, belonging to the f-block. The relative atomic mass of gadolinium is 157.25(3) Dalton, the number in the brackets indicating the uncertainty.

Related Product: Gadolinium Sputtering Target

Cerium Gadolinium Sputtering Target Packing

Our cerium gadolinium sputter targets are clearly tagged and labeled externally to ensure efficient identification and strict quality control. We take great care to prevent any potential damage during storage or transportation, ensuring the targets arrive in perfect condition.

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TFM offers Cerium Gadolinium Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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