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Cerium Oxide Sputtering Target

ST0140 Cerium Oxide Sputtering Target, CeO2

Chemical Formula: CeO2
Catalog Number: ST0140
CAS Number: 1306-38-3
Purity: 99.9%, 99.95%, 99.99%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Cerium Oxide sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

Introduction

Cerium Oxide (CeO₂) Sputtering Target is a widely used rare-earth oxide material known for its excellent oxygen storage capacity, high thermal stability, and unique redox behavior between Ce³⁺ and Ce⁴⁺ states. These properties make CeO₂ thin films essential in optical coatings, catalytic layers, solid oxide fuel cells, and advanced electronic applications. As a sputtering target, CeO₂ enables precise deposition of uniform oxide films with reliable chemical and physical performance.

Detailed Description

Our Cerium Oxide Sputtering Targets are manufactured from high-purity CeO₂ ceramic powders with carefully controlled stoichiometry and minimal impurity levels. Precise oxygen balance is critical, as it directly influences film conductivity, catalytic activity, and optical transparency.

The targets are produced through optimized powder processing, calcination, and high-temperature sintering to achieve high density and a uniform microstructure. A dense ceramic body reduces particle generation and arcing during RF sputtering, ensuring stable plasma conditions and consistent film composition. CeO₂ targets are available in standard round or rectangular shapes and can be supplied unbonded or bonded to metallic backing plates for improved heat dissipation and mechanical stability under higher sputtering power.

Applications

Cerium Oxide Sputtering Targets are widely used in a range of thin film applications, including:

  • Optical coatings and UV-blocking layers

  • Catalytic and oxygen-buffer layers

  • Solid oxide fuel cell (SOFC) components

  • Buffer and dielectric layers in oxide electronics

  • Gas sensors and environmental monitoring devices

  • Academic and industrial R&D on rare-earth oxides

Technical Parameters

ParameterTypical Value / RangeImportance
Chemical CompositionCeO₂Determines redox and catalytic behavior
Purity99.9% – 99.99%Minimizes defect-related performance loss
Diameter25 – 300 mm (custom available)Compatible with standard sputtering systems
Thickness3 – 6 mmInfluences target lifetime
Density≥ 95% theoreticalImproves plasma stability
Sputtering ModeRF sputteringRequired for ceramic oxides
BondingUnbonded / Cu or Ti backing (optional)Enhances thermal management

Comparison with Related Materials

MaterialKey AdvantageTypical Application
CeO₂Oxygen storage and redox activityCatalysis & electronics
ZrO₂High thermal stabilityThermal barrier coatings
Y₂O₃Optical transparencyOptical & dielectric films
Gd₂O₃Ionic conductivitySOFC-related layers

FAQ

QuestionAnswer
Can the CeO₂ target be customized in size?Yes, diameter, thickness, and shape can be tailored to your system.
Is RF sputtering required for CeO₂?Yes, CeO₂ is a ceramic oxide and typically requires RF sputtering.
Are bonded targets available?Yes, copper or titanium backing plates can be provided on request.
How is the target packaged?Vacuum-sealed with protective foam and export-grade cartons or crates.

Packaging

Our Cerium Oxide Sputtering Targets are meticulously labeled and vacuum-sealed to ensure traceability and protection from moisture and contamination. Export-grade packaging is used to prevent damage during storage and international transportation.

Conclusion

Cerium Oxide (CeO₂) Sputtering Target provides a reliable solution for depositing high-quality oxide thin films with excellent redox, optical, and catalytic properties. With high purity, controlled stoichiometry, and flexible customization options, it is well suited for advanced coatings, energy devices, and thin film research.
For detailed specifications and a quotation, please contact us at sales@thinfilmmaterials.com.

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CeO₂:TiO₂ Target (65:35 mol%, ~80:20 wt%) 99.99% ø150×6mm or 8mm Indium Bonded Cu B/Plate ø154.5×4mm, SnO₂–CeO₂ Target TRG 1:1, 99.9% Purity, ø50.8×3.2mm (±0.1mm), CeO₂ target 3N ø50.8×6.35 mm, CeO₂ target 99–99.99% Ø3"×3 mm, Bonded to 3 mm Cu BP, CeO₂ Target 3N Ø2"×0.25" In Bonded 2 mm Cu BP with Keeper (2 pcs), CeO₂ Target 3N Ø2"×6.35 mm, CeO₂ TRG 3N, Ø2″×6.35 mm

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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