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ST0140 Cerium Oxide Sputtering Target, CeO2

Chemical Formula: CeO2
Catalog Number: ST0140
CAS Number: 1306-38-3
Purity: 99.9%, 99.95%, 99.99%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Cerium Oxide sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Cerium Oxide Sputtering Target Description

The Cerium Oxide Sputtering Target from TFM is an oxide sputtering material with the chemical formula CeO2.

Cerium

Cerium is a chemical element named after Ceres, the Roman goddess of agriculture. It was first mentioned in 1803 and observed by H. Klaproth, J. Berzelius, and W. Hisinger. The isolation of cerium was later accomplished and announced by G. Mosander. The chemical symbol for cerium is “Ce,” and its atomic number is 58. Cerium is located in Period 6, Group 3 of the periodic table, within the f-block. Its relative atomic mass is 140.116(1) Dalton, with the number in brackets indicating the measurement uncertainty. Cerium is known for its use in catalytic converters, glass polishing, and as a component in various alloys.

Related Product: Cerium (Ce) Sputtering Target

OxygenOxygen is a chemical element whose name is derived from the Greek words ‘oxy’ and ‘genes,’ meaning acid-forming. It was first mentioned and observed by W. Scheele in 1771, who also later accomplished and announced its isolation. The chemical symbol for oxygen is “O,” and its atomic number is 8. Oxygen is located in Period 2, Group 16 of the periodic table, within the p-block. Its relative atomic mass is 15.9994(3) Dalton, with the number in parentheses indicating the measurement uncertainty. Oxygen is essential for respiration in most life forms and plays a critical role in combustion, oxidation, and various chemical reactions.

Cerium Oxide Sputtering Target Specification

Material TypeCerium (IV) Oxide
SymbolCeO2
Color/AppearanceWhite or Pale Yellow, Crystalline Solid
Melting Point (°C)~2,600
Theoretical Density (g/cc)7.13
SputterRF, RF-R
Type of BondIndium, Elastomer
CommentsVery little decomposition.

Cerium Oxide Sputtering Target Bonding

Specialized bonding services for Cerium Oxide Sputtering Targets, including indium and elastomeric bonding techniques, enhance performance and durability. Thin Film Materials (TFM) ensures high-quality solutions that meet industry standards and customer needs.

We also offer custom machining of backing plates, which is essential for sputtering target assembly. This comprehensive approach improves target design flexibility and performance in thin film deposition. Our channels provide detailed information about bonding materials, methods, and services, helping clients make informed decisions.

Cerium Oxide Sputtering Target Application

The Cerium Oxide Sputtering Target is used in a variety of applications, including thin film deposition, decorative coatings, semiconductors, displays, LEDs, and photovoltaic devices. It is also essential for functional coatings, the optical information storage industry, glass coatings for automotive and architectural purposes, and optical communication systems, among other fields.

Packaging

Our Cerium Oxide Sputtering Targets are meticulously tagged and labeled externally to ensure efficient identification and strict quality control. We take extensive precautions to prevent any damage during storage and transportation, maintaining the highest standards of product integrity upon delivery.

Get Contact

TFM offers   Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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