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ST0008 Cerium Sputtering Target, Ce

Chemical Formula: Ce
Catalog Number: ST0008
CAS Number: 7440-45-1
Purity: >99.9%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Cerium Sputtering Targets come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

 

MSDS File

Availability: 1 in stock

Cerium Sputtering Target Description

Cerium

Cerium sputtering targets share the properties of metallic cerium. Named after Ceres, the Roman god of agriculture, cerium was first identified in 1803 by H. Klaproth, J. Berzelius, and W. Hisinger. This iron-grey, lustrous metal is malleable and oxidizes quickly at room temperature, especially in moist air. Cerium is highly reactive, more so than other rare earth metals except europium. Both alkali and acid solutions rapidly corrode cerium, and the pure metal can ignite if scratched.

Cerium Sputtering Target Specification

Material TypeCerium
SymbolCe
Color/AppearanceSilvery White, Metallic
Melting Point798°C
Density~6.70g/cc
Thermal Conductivity1 W/m.K
Coefficient of Thermal Expansion6.3 x 10-6/K
Available SizesDia.: 2.0″, 3.0″, 4.0″, 5.0″, 6.0″
Thick: 0.125″, 0.250″

We also offer other customized shapes and sizes of the sputtering targets; please Contact Us for more information.

Cerium Sputtering Target Application

Cerium sputtering targets are used for:

  • Manufacturing aluminum alloys and certain steels and irons
  • Preventing graphitization in cast iron, producing malleable iron
  • Removing sulfides and oxides in steel, achieving complete detoxification
  • Serving as a precipitation-hardening agent in stainless steel

Handling Notes

  • Bonding services for cerium sputtering targets are currently unavailable.
  • Due to its high chemical reactivity, cerium sputtering targets require oil packaging and thorough cleaning to prevent environmental reactions.

Get Contact

TFM offers Cerium Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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