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ST0900 Chromium Cobalt Nickel High-Entropy Alloy (HEA) Sputtering Target, Co/Cr/Ni

Catalog No.ST0900
Chemical FormulaCo/Cr/Ni
Purity99.9%, 99.95%, 99.99%, 99.995%, 99.999%
ShapeDiscs, Plates, Column Targets, Step Targets, Custom-made

Chromium Cobalt Nickel High-Entropy Alloy (HEA) sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

CoCrNi High-Entropy Alloy (HEA) Sputtering Target Description

The CoCrNi High-Entropy Alloy (HEA) Sputtering Target is utilized in thin film deposition through sputtering techniques. This target is made from a high-entropy alloy consisting of cobalt (Co), chromium (Cr), and nickel (Ni). In physical vapor deposition (PVD) processes, a high-energy ion beam bombards the sputtering target, causing atoms to be ejected from its surface. These ejected atoms are then deposited onto a substrate, forming a thin film with the desired properties.

CoCrNi High-Entropy Alloy (HEA) Sputtering Target Handling Notes

Indium bonding is recommended for the CoCrNi High-Entropy Alloy (HEA) Sputtering Target because the alloy’s inherent brittleness and low thermal conductivity can pose challenges during sputtering. The low thermal conductivity makes the material prone to thermal shock, so indium bonding helps enhance the target’s stability and performance by mitigating these issues.

CoCrNi High-Entropy Alloy (HEA) Sputtering Target Application

CoCrNi High-Entropy Alloy (HEA) Sputtering Targets are widely employed in various industries, including electronics, optics, solar cells, and semiconductor manufacturing.

CoCrNi High-Entropy Alloy (HEA) Sputtering Target Packaging

We take great care in handling our CoCrNi High-Entropy Alloy (HEA) Sputtering Targets during storage and transportation to ensure they retain their quality and remain in pristine condition.

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TFM offers Chromium Cobalt Nickel High-Entropy Alloy (HEA) Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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