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ST0900 Chromium Cobalt Nickel High-Entropy Alloy (HEA) Sputtering Target, Co/Cr/Ni

Catalog No.ST0900
Chemical FormulaCo/Cr/Ni
Purity99.9%, 99.95%, 99.99%, 99.995%, 99.999%
ShapeDiscs, Plates, Column Targets, Step Targets, Custom-made

Chromium Cobalt Nickel High-Entropy Alloy (HEA) sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

Introduction

Chromium Cobalt Nickel High-Entropy Alloy (HEA) Sputtering Target, often abbreviated as Co/Cr/Ni HEA Sputtering Target, is designed for the deposition of advanced alloy thin films where compositional balance, structural stability, and functional performance matter. High-entropy alloy systems have attracted strong interest in materials science because they offer a different design philosophy from conventional alloys: instead of relying on one main element, they combine multiple principal elements to create thin films with distinctive mechanical, chemical, and microstructural behavior. For researchers and industrial users working on next-generation coatings, diffusion barriers, wear-resistant films, and functional surfaces, Co/Cr/Ni HEA targets provide a practical route to controlled alloy deposition.

Detailed Description

A Chromium Cobalt Nickel High-Entropy Alloy Sputtering Target is manufactured to deliver a stable source of chromium, cobalt, and nickel during sputtering processes such as DC magnetron sputtering or RF sputtering. In contrast to co-sputtering from separate elemental targets, a pre-alloyed Co/Cr/Ni target helps simplify process setup and improves consistency in the deposited film, especially when composition repeatability is important.

The combination of chromium, cobalt, and nickel is of particular interest because each element contributes different performance characteristics. Chromium is commonly associated with corrosion resistance, passivation behavior, and hardness contribution. Cobalt is valued in alloy systems for its magnetic relevance, thermal stability, and structural influence. Nickel supports toughness, ductility, and overall alloy stability. When these elements are combined in a high-entropy alloy framework, the resulting sputtering target can support the development of films with fine microstructures, good phase stability, and tunable surface or functional properties.

Target performance depends not only on chemistry, but also on density, homogeneity, impurity control, and manufacturing quality. A dense and well-consolidated HEA target generally provides more stable sputtering behavior, more uniform erosion, and better control over film composition. For demanding deposition environments, the target may also be supplied with a copper backing plate or other bonding option to improve heat dissipation and reduce thermal stress during operation.

Applications

Chromium Cobalt Nickel HEA Sputtering Targets are used in a range of advanced thin-film and surface engineering applications, including:

  • Materials research and development for high-entropy alloy thin films and composition screening

  • Wear-resistant coatings for surfaces requiring improved hardness and durability

  • Corrosion-resistant thin films for harsh or chemically active environments

  • Functional coatings in advanced mechanical, electronic, or microstructural studies

  • Magnetic and structural thin-film research involving cobalt- and nickel-containing alloy systems

  • Semiconductor and microfabrication laboratories studying multi-element alloy deposition behavior

  • Protective surface coatings for tools, components, and engineered substrates

Technical Parameters

ParameterTypical Value / RangeImportance
MaterialChromium Cobalt Nickel High-Entropy AlloyMulti-principal alloy system for advanced thin-film deposition
CompositionCo/Cr/Ni, custom atomic ratio availableDetermines film structure and functional properties
Purity99.9% – 99.99%Lower impurity levels support cleaner film growth
Diameter25 – 300 mm (custom)Fits a wide range of sputtering cathodes
Thickness3 – 8 mmInfluences target lifetime and sputtering stability
DensityHigh-density consolidated alloyImproves erosion uniformity and process consistency
BondingCopper backing plate or custom bonding availableEnhances thermal management during sputtering
Manufacturing RouteCast, hot-pressed, or powder-metallurgy basedAffects homogeneity and microstructure
Surface ConditionPrecision machined, ready to installSupports reliable plasma ignition and even sputtering

Comparison with Related Materials

MaterialKey AdvantageTypical Application
Chromium Cobalt Nickel HEA Sputtering TargetBalanced multi-element alloy designHEA thin films, protective and functional coatings
Chromium Sputtering TargetStrong corrosion and wear contributionHard coatings, adhesion layers
Cobalt Nickel Sputtering TargetUseful magnetic and structural alloy combinationMagnetic films, electronic coatings
Nickel Chromium Sputtering TargetEstablished resistive and protective film materialThin-film resistors, oxidation-resistant coatings

FAQ

QuestionAnswer
Can the Co/Cr/Ni HEA sputtering target be customized?Yes. Composition ratio, purity, dimensions, and bonding structure can be customized based on your sputtering system and film design goals.
Why use a pre-alloyed HEA target instead of separate elemental targets?A pre-alloyed target can simplify deposition, improve repeatability, and help maintain more consistent film composition.
Is this target suitable for research applications?Yes. It is widely suited to universities, laboratories, and R&D teams studying high-entropy alloy thin films and advanced coatings.
What backing plate options are available?Copper backing plates and other custom bonding solutions are commonly available to improve heat transfer and target stability.
How is the target packaged for shipment?It is typically vacuum-sealed, carefully cushioned, and packed in export-safe cartons or wooden crates depending on size and weight.

Packaging

Our Chromium Cobalt Nickel High-Entropy Alloy (HEA) Sputtering Target products are meticulously tagged and labeled externally to ensure efficient identification and maintain high standards of quality control. We take great care to prevent any potential damage during storage and transportation, ensuring the targets arrive in perfect condition.

Conclusion

Chromium Cobalt Nickel High-Entropy Alloy Sputtering Target offers an efficient and reliable solution for depositing advanced alloy thin films with controlled composition and strong research value. For customers developing next-generation coatings, high-entropy alloy films, or multi-element functional surfaces, Co/Cr/Ni HEA targets provide the consistency, customization, and material engineering flexibility needed for modern deposition processes.

For detailed specifications and a quotation, please contact us at [sales@thinfilmmaterials.com].

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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