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VD0606 Chromium Copper Evaporation Materials, Cr/Cu

Catalog No.VD0606
MaterialChromium Copper (Cr/Cu)
Purity99.9% ~ 99.95%
ShapePowder/ Granule/ Custom-made

TFM is an industry leader in manufacturing high-purity chromium copper evaporation materials, ensuring superior product reliability through stringent quality assurance processes. Our chromium copper materials are available in various forms, including tablets, granules, rods, and wires, catering to a wide range of industrial applications.

MSDS File

Chromium Copper Evaporation Materials Overview

TFM provides high-purity chromium copper evaporation materials, an alloy composed of chromium (Cr) and copper (Cu), engineered for optimal performance in deposition processes. With purity levels reaching up to 99.9995%, these materials are critical for producing high-quality deposited films. TFM ensures product reliability through rigorous quality control measures.

Related Products: Chromium Evaporation Materials, Copper Evaporation Materials

Applications of Chromium Copper Evaporation Materials

  • Deposition Processes: Perfect for a range of deposition techniques, including semiconductor deposition, chemical vapor deposition (CVD), and physical vapor deposition (PVD).
  • Optical Applications: Widely used in optics for wear protection, decorative coatings, and display applications.

Packaging of Chromium Copper Evaporation Materials

At TFM, we meticulously package our chromium copper evaporation materials to prevent any potential damage during storage and transportation, ensuring that the products arrive in perfect condition.

Contact Us

TFM is a premier manufacturer and supplier of high-purity chromium copper evaporation materials and a variety of other evaporation pellets. We offer these materials in both powder and granule forms, with customization options available upon request. Please reach out to us for current pricing and inquiries about additional deposition materials not listed.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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