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chromium-diboride

VD0831 Chromium Diboride Evaporation Materials, CrB2

Catalog No.VD0831
MaterialChromium Boride (CrB2)
Purity99.9%
ShapePowder/ Granule/ Custom-made

TFM stands out as a top manufacturer and supplier of high-quality chromium diboride evaporation materials. We provide an extensive range of evaporation materials, available in both powder and granule forms. For specific needs, we also offer customized options to meet your unique requirements.

MSDS File

Chromium Diboride Evaporation Materials Overview

Chromium diboride (CrB₂) is a key material used in high-precision deposition processes, offering exceptional quality for film deposition applications. TFM specializes in providing chromium diboride with an impressive purity level of up to 99.9995%. This high purity is essential for ensuring the reliability and quality of deposited films in various high-tech applications.

Specifications

Material TypeChromium diboride
SymbolAlB2
Appearance/ColorSolid
Melting Point1,950 to 2,050 °C (3,540 to 3,720 °F; 2,220 to 2,320 K)
Density6.17 g/cm3
Purity99.9%
ShapePowder/ Granule/ Custom-made

Applications

Chromium diboride evaporation materials are integral to several deposition techniques, including:

  • Semiconductor Deposition
  • Chemical Vapor Deposition (CVD)
  • Physical Vapor Deposition (PVD)

These materials are predominantly used in optical coatings, such as wear-resistant layers, decorative finishes, and display technologies.

Packaging and Handling

To ensure the highest standards of quality and prevent damage, chromium diboride evaporation materials are carefully tagged, labeled, and packed. This meticulous approach aids in maintaining product integrity during storage and transportation.

Contact Information

TFM is a premier provider of high-purity chromium diboride evaporation materials, available in various forms such as tablets, granules, rods, and wires. We also offer custom solutions tailored to your specific needs. In addition to chromium diboride, TFM supplies a range of evaporation sources, including boats, filaments, crucibles, heaters, and e-beam crucible liners. For up-to-date pricing and availability of both listed and custom materials, please contact us directly with your inquiry.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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