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VD0726 Chromium Doped Silicon Monoxide Evaporation Materials, Cr-SiO

Catalog No.VD0726
MaterialChromium Doped Silicon Monoxide (Cr-SiO)
Purity99.9% ~ 99.99%
ShapePowder/ Granule/ Custom-made

TFM stands out as a top manufacturer and provider of high-purity chromium-doped silicon monoxide evaporation materials. Our extensive range includes both powder and granule forms of evaporation materials. For tailored solutions, we also offer custom forms to meet specific requirements.

Chromium-Doped Silicon Monoxide Evaporation Materials Overview

Chromium-doped silicon monoxide (Cr-SiO) evaporation materials are crucial in the deposition industry, providing a high level of purity essential for creating high-quality films. These materials, with a chemical composition of Cr-SiO, are produced with exceptional precision, reaching purities of up to 99.9995%. Our manufacturing process includes stringent quality assurance measures to ensure reliability and performance.

Applications of Cr-Doped SiO Evaporation Materials

Chromium-doped silicon monoxide evaporation materials are versatile and used in various applications:

  • Deposition Processes: Ideal for semiconductor deposition, chemical vapor deposition (CVD), and physical vapor deposition (PVD).
  • Optics: Suitable for wear protection, decorative coatings, and display technologies.

Packaging and Quality Control

To ensure the integrity and quality of chromium-doped silicon monoxide evaporation materials, each product is carefully tagged and labeled. We prioritize protecting the material from damage during both storage and transportation.

Contact Us

We, at TFM, are a premier supplier of high-purity Cr-doped SiO evaporation materials. Our offerings include various forms such as tablets, granules, rods, and wires, with customized options available upon request. In addition to evaporation materials, we supply evaporation sources, boats, filaments, crucibles, heaters, and e-beam crucible liners. For current pricing and additional information on materials not listed, please reach out to us directly.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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