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Chromium(III) Fluoride Evaporation Materials

VD0778 Chromium(III) Fluoride Evaporation Materials, CrF3

Catalog No.VD0778
MaterialChromium Fluoride (CrF3)
Purity99.9%
ShapePowder/ Granule/ Custom-made

TFM is a leading provider of high-purity Chromium(III) Fluoride evaporation materials, as well as a diverse range of other evaporation materials. Our Chromium(III) Fluoride products are available in both powder and granule forms, with options for customized formats to meet specific needs upon request.

MSDS File

TFM: Premium Chromium(III) Fluoride Evaporation Materials

TFM specializes in high-purity Chromium(III) Fluoride (CrF3) evaporation materials, essential for achieving high-quality deposited films. Our Chromium(III) Fluoride products are manufactured with purity levels up to 99.9995%, thanks to rigorous quality control processes that ensure superior performance and reliability.

Chromium(III) Fluoride Evaporation Materials Specification

Material TypeChromium(III) Fluoride
SymbolCrF3
Appearance/ColorGreen crystalline solid
Melting Point1,100 °C (2,010 °F; 1,370 K) (sublimes)
Density3.8 g/cm3 (anhydrous)
2.2 g/cm3 (trihydrate)
Purity99.9%
ShapePowder/ Granule/ Custom-made

Applications

Chromium(III) Fluoride evaporation materials are versatile and used in:

  • Semiconductor Deposition
  • Chemical Vapor Deposition (CVD)
  • Physical Vapor Deposition (PVD)

These materials are also employed in optics for wear protection, decorative coatings, and displays.

Packaging

Our Chromium(III) Fluoride materials are meticulously tagged and labeled to ensure proper identification and quality control. We take special care to prevent any damage during storage and transport.

Contact Us

TFM offers Chromium(III) Fluoride in various forms, including tablets, granules, rods, and wires. Custom shapes and quantities are available upon request. Additionally, we provide related products such as evaporation sources, boats, filaments, crucibles, heaters, and e-beam crucible liners. For current pricing and additional inquiries, please contact us directly.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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