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Chromium Nickel Evaporation Materials

VD0608 Chromium Nickel Evaporation Materials, Cr/Ni

Catalog No.VD0608
MaterialChromium Nickel (Cr/Ni)
Purity99.9% ~ 99.95%
ShapePowder/ Granule/ Custom-made

At TFM, we are dedicated to manufacturing high-purity chromium-nickel evaporation materials, ensuring exceptional reliability through rigorous quality assurance processes. Our product range includes a variety of forms to suit different applications, such as tablets, granules, rods, and wires. Each of these products is crafted to meet the highest standards, providing consistent performance for your needs.

MSDS File

High-Purity Chromium Nickel Evaporation Materials

TFM offers premium chromium-nickel evaporation materials, featuring an alloy of chromium (Cr) and nickel (Ni) with exceptional purity levels up to 99.9995%. These materials are crucial for producing high-quality deposited films, thanks to their superior performance and reliability. Our rigorous quality assurance processes ensure that each product meets the highest standards.

Uses of Chromium Nickel Evaporation Materials

Chromium-nickel evaporation materials are versatile and essential in various advanced applications:

  • Deposition Processes: They play a vital role in semiconductor deposition, chemical vapor deposition (CVD), and physical vapor deposition (PVD) techniques.
  • Optics: These materials are used for creating durable coatings, decorative finishes, and display components.

Product Packaging and Handling

To maintain the integrity and quality of our chromium-nickel evaporation materials, we handle and package them with the utmost care. This ensures that they remain in optimal condition during storage and transportation.

Get in Touch with Us

As a leading provider of high-purity chromium-nickel evaporation materials, TFM offers products in both powder and granule forms. We also provide customized solutions upon request. For current pricing and inquiries about our evaporation materials and other deposition products, please contact us.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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