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ST0141 Chromium Oxide Sputtering Target, Cr2O3

Chemical Formula: Cr2O3
Catalog Number: ST0141
CAS Number: 1308-38-9
Purity: 99.9%, 99.95%, 99.99%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Chromium Oxide sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Chromium Oxide Sputtering Target Description

The Chromium Oxide Sputtering Target from TFM is an oxide sputtering material with the chemical formula Cr2O3.

Chromium

Chromium is a chemical element named after the Greek word ‘chroma,’ meaning color, due to the various colorful compounds it forms. It was first used before 1 AD and is famously associated with the discovery of the Terracotta Army. The chemical symbol for chromium is “Cr,” and it has an atomic number of 24. Chromium is located in Period 4, Group 6 of the periodic table, within the d-block. Its relative atomic mass is 51.9961(6) Dalton, with the number in brackets indicating the measurement uncertainty. Chromium is widely used in metallurgy, dyes, and pigments due to its high corrosion resistance and hardness.

Chromium is widely used in the automobile industry to create the shiny coatings found on wheels and bumpers. It is also extensively utilized in many vacuum applications, including automotive glass coatings, photovoltaic cell fabrication, battery fabrication, and decorative and corrosion-resistant coatings.

Related Product: Chromium Sputtering Target

OxygenOxygen is a chemical element whose name is derived from the Greek words ‘oxy’ and ‘genes,’ meaning acid-forming. It was first mentioned and observed by W. Scheele in 1771, who also later accomplished and announced its isolation. The chemical symbol for oxygen is “O,” and its atomic number is 8. Oxygen is located in Period 2, Group 16 of the periodic table, within the p-block. Its relative atomic mass is 15.9994(3) Dalton, with the number in parentheses indicating the measurement uncertainty. Oxygen is essential for respiration in most life forms and is crucial in combustion, oxidation, and various chemical reactions.

Chromium Oxide Sputtering Target Specification

Material TypeChromium Oxide
SymbolCr2O3
Color/AppearanceGreen, Crystalline Solid
Melting Point 2,266℃
SputterRF, RF-R
Type of BondIndium, Elastomer
CommentsDisproportionates to lower oxides; reoxidizes at 600°C in air.
Available SizesDia.: 2.0″, 3.0″, 4.0″, 5.0″, 6.0″
Thick: 0.125″, 0.250″

We also offer other customized shapes and sizes of the sputtering targets; please Contact Us for more information.

Chromium Oxide Sputtering Target Bonding

Specialized bonding services for chromium oxide Sputtering Targets, including indium and elastomeric bonding techniques, enhance performance and durability. Thin Film Materials (TFM) ensures high-quality solutions that meet industry standards and customer needs.

We also offer custom machining of backing plates, which is essential for sputtering target assembly. This comprehensive approach improves target design flexibility and performance in thin film deposition. Our channels provide detailed information about bonding materials, methods, and services, helping clients make informed decisions.

Our chromium oxide sputter target is clearly tagged and labeled externally to ensure efficient identification and quality control. Great care is taken to avoid any damage which might be caused during storage or transportation.

Get Contact

TFM offers Chromium Oxide Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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