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Chromium Oxide Sputtering Target

ST0141 Chromium Oxide Sputtering Target, Cr2O3

Chemical Formula: Cr2O3
Catalog Number: ST0141
CAS Number: 1308-38-9
Purity: 99.9%, 99.95%, 99.99%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Chromium Oxide sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

Chromium Oxide (Cr₂O₃) Sputtering Target

Introduction

Chromium Oxide (Cr₂O₃) Sputtering Targets are widely used ceramic materials for thin film deposition in optics, electronics, and protective coatings. Known for their high hardness, chemical stability, and attractive optical properties, Cr₂O₃ thin films are applied in wear-resistant surfaces, antireflective coatings, sensors, and semiconductor devices. With excellent adhesion and durability, these targets serve both industrial production and academic research.

Detailed Description

Chromium Oxide sputtering targets are typically fabricated by pressing and sintering high-purity chromium oxide powders to achieve a dense ceramic body. The result is a mechanically stable target with uniform composition and good sputtering efficiency.

Key features include:

  • High Purity (≥99.9%) – ensures reproducible film quality and minimal contamination.

  • Stable Ceramic Structure – dense sintered target for consistent sputtering.

  • High Hardness and Wear Resistance – enables deposition of durable protective films.

  • Optical Functionality – Cr₂O₃ films exhibit distinct optical absorption, useful for coatings.

  • Custom Bonding Options – indium or elastomer bonding to copper backing plates available for high-power sputtering.

Applications

Chromium Oxide sputtering targets are commonly used in:

  • Optical Coatings – antireflective and absorptive coatings.

  • Wear-Resistant Films – hard coatings for tools and components.

  • Semiconductor Devices – thin films in microelectronics and sensors.

  • Catalytic and Functional Films – films with chemical stability for catalytic applications.

  • R&D in Advanced Materials – studies in oxide electronics and coatings.

Technical Parameters

ParameterTypical Value / RangeImportance
Purity99.9% – 99.99%Ensures high-quality thin films
CompositionCr₂O₃Provides hardness & stability
Diameter25 – 200 mm (customizable)Fits sputtering systems
Thickness3 – 10 mmAffects sputtering rate & lifetime
BondingIndium / Elastomer / Copper backingImproves thermal management

Comparison with Related Materials

MaterialKey AdvantageTypical Application
Chromium OxideHardness, optical absorptionWear-resistant, optical coatings
Chromium (metal)High conductivity, reflective filmsDecorative, conductive coatings
Titanium Oxide (TiO₂)High transparency, dielectricOptical & dielectric films

FAQ

QuestionAnswer
What purity levels are available?Standard targets are 99.9% (3N) and 99.99% (4N).
Can targets be bonded to backing plates?Yes, indium or elastomer bonding to copper is available.
Which industries use Cr₂O₃ films most?Optics, semiconductors, tool coatings, and R&D.
How are the targets packaged?Each target is vacuum-sealed, foam-protected, and shipped in export-safe cartons or crates.
Are custom shapes available?Yes, we can supply circular, rectangular, or planar targets on request.

Packaging

Each Chromium Oxide sputtering target is vacuum-sealed in moisture-proof packaging and labeled for traceability. Targets are secured with foam and shipped in durable cartons or wooden crates to prevent damage during transit.

Conclusion

Chromium Oxide (Cr₂O₃) Sputtering Targets deliver exceptional performance in producing hard, chemically stable, and optically functional films. With high purity, durable ceramic structure, and customizable options, they are a reliable choice for semiconductor, optical, and protective coating applications.

For detailed specifications and a quotation, please contact us at [sales@thinfilmmaterials.com].

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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