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ST0009A Chromium Silicate Sputtering Targets

MSDS File
Material TypeChromium Silicate
SymbolCrSiO2
Color/AppearanceVarious colors, Solid
Melting Point (°C)N/A
Relative Density (g/cc)>90%
Z RatioN/A
SputterRF, DC
Max Power Density*
(Watts/Square Inch)
Type of BondIndium, Elastomer
Comments

Chromium Silicate Sputtering Targets

Chromium Silicate (CrSiO₄) sputtering targets are high-purity materials used in various advanced applications, particularly in the production of thin films for semiconductor, optics, and electronics industries. These targets are favored for their excellent properties in producing coatings that are resistant to oxidation, wear, and corrosion.

Specifications

  • Purity: 99.9%
  • Circular Targets: Diameter ≤ 14 inches, Thickness ≥ 1mm
  • Block Targets: Length ≤ 32 inches, Width ≤ 12 inches, Thickness ≥ 1mm

Key Features and Advantages

  • High Purity: TFM’s Chromium Silicate sputtering targets are made with a purity of 99.9%, ensuring high-quality thin films with consistent and reliable deposition in sensitive applications.
  • Custom Sizes Available: These targets are available in custom sizes to meet the specific requirements of both R&D and large-scale production, offering flexibility and adaptability.
  • Enhanced Wear Resistance: Chromium Silicate coatings produced from these sputtering targets exhibit enhanced wear and corrosion resistance, making them ideal for use in harsh environments.
  • Oxidation Resistance: The material’s ability to resist oxidation makes it suitable for high-temperature applications, contributing to longer-lasting and more reliable performance in various sectors.
  • Vacuum Compatible: These targets are thoroughly cleaned and packaged to be compatible with vacuum deposition systems, ensuring protection from environmental contamination during transportation and storage.

Applications

  • Semiconductors: Chromium Silicate is used in semiconductor industries to produce thin films that enhance the performance and durability of microelectronic devices.
  • Optics: The thin films produced with Chromium Silicate targets are used in optical coatings, offering excellent protection against wear and environmental damage, as well as improved optical properties.
  • Electronics: Chromium Silicate thin films are used in electronic components to enhance their durability and reliability, particularly in circuitry and electromagnetic shielding applications.
  • Wear-Resistant Coatings: The superior wear resistance of Chromium Silicate makes it an ideal choice for coatings in industrial applications where materials are exposed to abrasion, friction, or extreme conditions.
  • Corrosion Protection: The material is also used in coatings that provide corrosion resistance for various metallic surfaces, making it suitable for automotive and aerospace applications.

Manufacturing Process

  • Cold-Pressed and Sintered: TFM’s Chromium Silicate sputtering targets are cold-pressed and sintered to achieve high density and uniformity, ensuring efficient and reliable deposition.
  • Elastomer Bonding: The sputtering target is elastomer bonded to the backing plate, which improves the durability and handling of the target during the sputtering process.
  • Cleaning and Packaging: All targets are cleaned thoroughly and carefully packaged to avoid contamination, ensuring they are ready for vacuum deposition processes in demanding applications.

Available Options

  • 99.9% Purity: TFM offers Chromium Silicate sputtering targets with a 99.9% purity to ensure optimal performance in thin film deposition, delivering consistent results across various industries.
  • Custom Sizes: Targets are available in a variety of custom sizes to suit specific needs in both small-scale research and large-scale production environments.
  • R&D Applications: Smaller sizes of Chromium Silicate sputtering targets are available for research and development (R&D) purposes, offering flexibility for experimentation and prototyping.
  • Sputtering Target Bonding Service: TFM provides a bonding service to secure the sputtering target to the backing plate, ensuring enhanced performance in demanding applications.

Conclusion

TFM’s Chromium Silicate Sputtering Targets are ideal for applications requiring wear resistance, oxidation resistance, and high-temperature stability. With their 99.9% purity, customizable sizes, and reliable manufacturing processes, these targets provide high-quality thin films for semiconductor, optics, and electronics industries. Whether used in research, development, or industrial production, Chromium Silicate sputtering targets from TFM deliver consistent, high-performance results across various advanced technologies.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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