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Chromium Titanium Sputtering Target

ST0075 Chromium Titanium Sputtering Target, Cr/Ti

Chemical Formula: Cr/Ti
Catalog Number: ST0075
CAS Number: 7440-47-3 | 7440
Purity: 99.9%, 99.95%, 99.99%, 99.995%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Chromium Titanium  sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

Chromium Titanium Sputtering Target

Introduction

The Chromium Titanium Sputtering Target is a specialized alloy material designed for thin film deposition in electronics, optics, and advanced surface engineering. By combining chromium’s hardness and corrosion resistance with titanium’s toughness and lightweight properties, this alloy enables the production of durable, functional coatings with excellent adhesion and stability. It is widely used in decorative films, wear-resistant coatings, and semiconductor applications.

Detailed Description

Chromium Titanium sputtering targets are fabricated using high-purity raw materials through vacuum melting or powder metallurgy processes. The resulting alloy exhibits a homogeneous microstructure that ensures consistent sputtering performance and stable thin film quality.

Key features include:

  • High Purity (≥99.9%) – ensures low contamination and reliable deposition results.

  • Strong Mechanical Integrity – prevents cracking during sputtering, extending target lifetime.

  • Excellent Corrosion & Wear Resistance – alloy films perform well in harsh environments.

  • Customizable Composition – common ratios include Cr:Ti = 50:50 at% or tailored blends for specific applications.

  • Optional Bonding – indium or elastomer bonding to copper backing plates for high-power magnetron sputtering systems.

Applications

Chromium Titanium sputtering targets are commonly used in:

  • Semiconductors – functional thin films in microelectronics.

  • Optical Coatings – reflective and protective coatings for lenses and optical devices.

  • Decorative Coatings – hard, corrosion-resistant coatings with metallic luster.

  • Wear-Resistant Films – protective layers in tools, automotive, and aerospace components.

  • Energy Devices – thin films for specialized battery and solar applications.

Technical Parameters

ParameterTypical Value / RangeImportance
Purity99.9% – 99.99%Ensures consistent film quality
CompositionCr:Ti (50:50 at% standard)Provides balanced mechanical & corrosion properties
Diameter25 – 200 mm (customizable)Fits different sputtering systems
Thickness3 – 10 mmInfluences sputtering rate
BondingIndium / Elastomer / CopperImproves heat transfer and stability

Comparison with Related Materials

MaterialKey AdvantageTypical Application
Chromium TitaniumHard, corrosion-resistant, durableDecorative & wear-resistant films
Pure ChromiumExcellent hardness & reflectivityProtective & reflective coatings
Pure TitaniumLightweight, strong adhesionDecorative & functional coatings

FAQ

QuestionAnswer
Can the Cr/Ti ratio be customized?Yes, we provide standard and custom atomic ratios.
Which industries use this target?Electronics, optics, decorative coatings, aerospace, and energy.
Is bonding necessary?Recommended for high-power sputtering to prevent cracking.
How are the targets packaged?Vacuum-sealed, foam-protected, and shipped in export-safe cartons or crates.
What deposition methods are suitable?Primarily magnetron sputtering, both DC and RF.

Packaging

Chromium Titanium sputtering targets are carefully vacuum-sealed with moisture protection and individually labeled. Each unit is packed in foam-lined export cartons or wooden crates to ensure safe handling and transportation.

Conclusion

The Chromium Titanium Sputtering Target offers a reliable solution for producing hard, corrosion-resistant, and functional thin films. With high purity, customizable composition, and durable performance, it is a versatile choice for semiconductor, optical, decorative, and protective coating applications.

For detailed specifications and a quotation, please contact us at [sales@thinfilmmaterials.com].

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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