Thin Film Materials Logo
Generic selectors
Exact matches only
Search in title
Search in content
Post Type Selectors
Chromium Vanadium Sputtering Target

ST0076 Chromium Vanadium Sputtering Target, Cr/V

Chemical Formula: Cr/V
Catalog Number: ST0076
CAS Number: 7440-47-3 | 7440
Purity: 99.9%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

 Chromium Vanadium sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Chromium Vanadium Sputtering Target Description

The chromium-vanadium sputtering target from TFM is a silvery alloy material composed of chromium (Cr) and vanadium (V). This sputtering target is designed for applications that benefit from the combined properties of these two elements.

Chromium

Chromium, symbolized as “Cr,” is a chemical element derived from the Greek word ‘chroma,’ meaning color. Known and utilized since before 1 AD, chromium was notably associated with the Terracotta Army. It has an atomic number of 24 and is situated in Period 4, Group 6 of the d-block in the periodic table. The relative atomic mass of chromium is 51.9961(6) Daltons, with the number in brackets representing the measurement uncertainty.

Related Product: Chromium Sputtering Target

Vanadium

Vanadium is a chemical element originated from Vanadis, an old Norse name for the Scandinavian goddess Freyja. It was first mentioned in 1801 and observed by M. del Río. The isolation was later accomplished and announced by N.G.Sefström. “V” is the canonical chemical symbol of vanadium. Its atomic number in the periodic table of elements is 23 with location at Period 4 and Group 5, belonging to the d-block. The relative atomic mass of vanadium is 50.9415(1) Dalton, the number in the brackets indicating the uncertainty.

Related Product: Vanadium Sputtering Target

Chromium Vanadium Sputtering Target Packaging

Our chromium-vanadium sputtering targets are meticulously handled to prevent any damage during storage and transportation, ensuring they remain in their original, high-quality condition.

Get Contact

TFM offers Chromium Vanadium Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

Reviews

There are no reviews yet.

Be the first to review “ST0076 Chromium Vanadium Sputtering Target, Cr/V”

Your email address will not be published. Required fields are marked *

Related Products

Related products

FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
Shopping Cart
Scroll to Top