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ST0077 Cobalt Aluminum Sputtering Target, Co/Al

Chemical Formula:Ā Co/Al
Catalog Number:Ā ST0077
CAS Number:Ā 7440-48-4 | 7429
Purity:Ā 99.9%, 99.95%, 99.99%
Shape:Ā Discs, Plates, Column Targets, Step Targets, Custom-made

Cobalt AluminumĀ  sputtering targetĀ  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Cobalt Aluminum Sputtering Target Description

The cobalt-aluminum sputtering target from TFM is a silvery alloy composed of cobalt (Co) and aluminum (Al). This sputtering material is ideal for applications requiring the specific properties of these two elements.

Cobalt

Cobalt, symbolized as “Co,” is a chemical element named after the German word ā€˜kobald,ā€™ meaning goblin. It was first mentioned in 1732 and observed by G. Brandt. Cobalt’s atomic number is 27, and it is located in Period 4, Group 9 of the d-block in the periodic table. Its relative atomic mass is 58.933195(5) Daltons, with the number in brackets indicating the measurement uncertainty.

Related Product: Cobalt Sputtering Target

AluminumAluminium, also known as aluminum, is a chemical element derived from the Latin word for alum, ā€˜alumen,ā€™ meaning bitter salt. It was first mentioned and observed in 1825 by H.C. Ƙrsted, who also accomplished its isolation. Aluminium is represented by the symbol “Al” and has an atomic number of 13. It is located in Period 3, Group 13 of the p-block in the periodic table. The relative atomic mass of aluminium is 26.9815386(8) Daltons, with the number in brackets indicating the measurement uncertainty.

Cobalt Aluminum Sputtering Target Packaging

Our cobalt-aluminum sputtering targets are meticulously handled to prevent any damage during storage and transportation. This careful handling ensures that our products maintain their original quality and arrive in perfect condition.

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TFM offers Cobalt Aluminum Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

Itā€™s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Alā‚‚Oā‚ƒ, SiOā‚‚, TiOā‚‚), alloys, or compositesā€”chosen based on the filmā€™s desired properties.

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They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

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In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

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Key factors include the targetā€™s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

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Operators monitor target erosion (often by measuring the depth of the eroded ā€œrace trackā€) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

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Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

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DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the targetā€™s surface.

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In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also ā€œpoisonā€ the target surface if not carefully controlled.

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Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

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Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

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