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VD0543 Cobalt (Co) Evaporation Materials

Material Type: Cobalt
Symbol: Co
Atomic Weight: 58.933195
Atomic Number: 27
Color/Appearance: Lustrous, Metallic, Grayish Tinge

TFM is a leading provider of high-purity cobalt evaporation materials, offering a broad selection of evaporation products. As a top manufacturer and supplier, we deliver cobalt materials in various forms, including powders, granules, and custom shapes tailored to meet specific requirements. Our extensive range ensures that we can accommodate a wide variety of applications.

MSDS File

Cobalt Evaporation Materials Description

High-purity cobalt evaporation materials are essential for achieving high-quality films in deposition processes. Cobalt, a hard, gray, ferromagnetic metal, is known for its stability in air and low reactivity. It is insoluble in water, with a melting point of 1,495°C and a boiling point of 2,927°C. Cobalt is commonly used in manufacturing magnetic materials and high-strength superalloys due to its durability and unique properties.

TFM specializes in producing cobalt evaporation materials with purity levels up to 99.99%. Our rigorous quality assurance processes ensure the reliability and consistency of these materials, making them ideal for demanding applications.

cobalt evaporation materials

Cobalt Evaporation Materials Specification

Material TypeCobalt
SymbolCo
Color/AppearanceLustrous, Metallic, Grayish Tinge
Melting Point1,495 °C
Thermal Conductivity100 W/m.K
Density8.9 g/cc

Cobalt Evaporation Materials Applications

Cobalt evaporation materials are widely utilized in various deposition processes, including semiconductor deposition, Chemical Vapor Deposition (CVD), and Physical Vapor Deposition (PVD). In the field of optics, they are used for applications such as wear protection, decorative coatings, and display technologies. Their high purity and performance make them indispensable for achieving precise and durable results in these advanced applications.

Cobalt Evaporation Materials Packing

We handle our cobalt evaporation materials with great care to prevent any damage during storage and transportation. This meticulous attention ensures that the materials maintain their original quality, delivering consistent and reliable performance when used.

Ordering Table 

Material Size Quantity Purity Part Number
Cobalt 1/4" Dia. x 1/4" Length 1 lb./454 g 99.95% EVMCO35QXQ
Cobalt 1/4" Dia. x 1/4" Length 25 g 99.95% EVMCO35QXQA
Cobalt 1/4" Dia. x 1/4" Length 50 g 99.95% EVMCO35QXQB
Cobalt 1/4" Dia. x 1/4" Length 100 g 99.95% EVMCO35QXQD
Cobalt 1/4" Dia. x 1/4" Length 250 g 99.95% EVMCO35QXQJ
Cobalt 1/4" Dia. x 1/4" Length 25 g 99.99% EVMCO40QXQA
Cobalt 1/4" Dia. x 1/4" Length 100 g 99.99% EVMCO40QXQD
Cobalt 1/8" Dia. x 1/8" Length 1 lb. 99.95% EVMCO35EXE
Cobalt 1/8" Dia. x 1/8" Length 25 g 99.95% EVMCO35EXEA
Cobalt 1/8" Dia. x 1/8" Length 50 g 99.95% EVMCO35EXEB
Cobalt 1/8" Dia. x 1/8" Length 100 g 99.95% EVMCO35EXED
Cobalt 1/8" Dia. x 1/8" Length 250 g 99.95% EVMCO35EXEJ
Cobalt 1/8" Dia. x 1/8" Length 500 g 99.95% EVMCO35EXET
Cobalt 1/8" Dia. x 1/8" Length 25 g 99.99% EVMCO40EXEA
Cobalt 1/8" Dia. x 1/8" Length 100 g 99.99% EVMCO40EXED

 

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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