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VD0614 Cobalt Nickel Chromium Evaporation Materials, Co/Ni/Cr

Catalog No.VD0614
MaterialCobalt Nickel Chromium (Co/Ni/Cr)
Purity99.9% ~ 99.95%
ShapePowder/ Granule/ Custom-made

TFM excels in producing high-purity cobalt nickel chromium evaporation materials, ensuring top-notch reliability through stringent quality assurance processes. Our materials come in a range of forms, including tablets, granules, pellets, and powder, catering to diverse application needs.

MSDS File

Cobalt Nickel Chromium Evaporation Materials: Overview

TFM offers premium cobalt nickel chromium evaporation materials, an alloy composed of cobalt (Co), nickel (Ni), and chromium (Cr). Our materials are renowned for their high purity, reaching up to 99.9995%, which is crucial for ensuring high-quality deposited films in various applications. We employ rigorous quality assurance processes to guarantee the reliability and performance of our products.

Applications of Cobalt Nickel Chromium Evaporation Materials

Our cobalt nickel chromium materials are ideal for:

  • Deposition Processes: Essential for semiconductor deposition, chemical vapor deposition (CVD), and physical vapor deposition (PVD).
  • Optics: Used in applications such as wear protection, decorative coatings, and displays.

Packaging and Handling

We prioritize the careful handling of our cobalt nickel chromium evaporation materials to avoid damage during storage and transportation. This ensures that the materials remain in optimal condition and maintain their high quality.

Contact Us

As a leading provider of high-purity cobalt nickel chromium evaporation materials, TFM offers these materials in powder and granule forms, with custom options available upon request. For the latest pricing or to inquire about other deposition materials, please reach out to us directly.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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