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ST0010 Cobalt Sputtering Target, Co

Chemical Formula: Co
Catalog Number: ST0010
CAS Number: 7440-48-4
Purity: >99.95%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Cobalt sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

 

MSDS File

Availability: 1 in stock

Cobalt Sputtering Target Description

cobalt

Cobalt is a ferromagnetic metal with a high melting point and notable hardness, making it suitable for many industrial applications. It serves as a blue pigment in paints, jewelry, and glass and is vital for producing alloys used in engine parts and cutting tools. Cobalt sputtering targets are crucial for creating ferromagnetic layers in magnetic storage media and transitional layers in battery fabrication.

Cobalt Sputtering Target Specification

Material TypeCobalt
SymbolCo
Color/AppearanceLustrous, Metallic, Grayish Tinge
Melting Point1,495 °C
Thermal Conductivity100 W/m.K
Density8.9 g/cc
SputterDC
Coefficient of Thermal Expansion13.0 x 10-6/K
CommentsAlloys with W/Ta/Mo
Available SizesDia.: 2.0″, 3.0″, 4.0″, 5.0″, 6.0″
Thick: 0.125″, 0.250″

We also offer other customized shapes and sizes of the sputtering targets; please Contact Us for more information.

Cobalt Sputtering Target Application

Cobalt sputtering targets are used in various industries:

  • Semiconductors and Microelectronics: Fabrication of microprocessors, DRAMs, and other devices.
  • Magnetic Storage Media: Creation of high-density storage with high-temperature resistance and demagnetization prevention.
  • Battery Fabrication: Development of battery materials with high energy density and thermal stability.
  • Aerospace and Automotive: Cobalt alloys used in turbine blades and engine components for their high-temperature strength.
  • Medical Devices: Medical implants and tools due to cobalt’s biocompatibility and durability.

Ordering and Customization

Our cobalt sputtering targets can be customized to meet your specific requirements, including size, thickness, and purity levels. Inquire here to discuss your specific needs.

Quality Assurance and Packaging

Each cobalt sputtering target is clearly tagged and labeled for easy identification and quality control. We take great care during storage and transportation to ensure the product remains undamaged.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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