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ST0918 Cobalt Terbium Iron Sputtering Target, Co/Tb/Fe

Chemical FormulaCo/Tb/Fe
Catalog No.ST0918
CAS Number–
Purity99.9%, 99.95%, 99.99%, 99.995%, 99.999%
ShapeDiscs, Plates, Column Targets, Step Targets, Custom-made

Cobalt Terbium Iron sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Cobalt Terbium Iron Sputtering Target Description

The Cobalt Terbium Iron Sputtering Target is a specialized material used in sputter deposition, a technique for producing thin films with precise characteristics. In this process, high-energy ions bombard the target material in a vacuum chamber, causing atoms or particles to be ejected. These ejected particles then deposit onto a substrate, forming a thin film that retains the composition and properties of the target material. This technique is widely used in various industries, including electronics and optics, to create thin films with specific properties tailored to different applications.

Related Product: Cobalt Oxide Sputtering Target

Cobalt Terbium Iron Sputtering Target Specifications

Compound FormulaCo/Tb/Fe
Molecular Weight–
AppearanceMetallic Target
Melting Point–
Density–
Available SizesDia.: 1.0″, 2.0″, 3.0″, 4.0″, 5.0″, 6.0″

Thick: 0.125″, 0.250″

Cobalt Terbium Iron Sputtering Target Handling Notes

Indium bonding is recommended for the Cobalt Terbium Iron Sputtering Target due to its characteristics that are not ideal for conventional sputtering processes, such as brittleness and low thermal conductivity. The Cobalt Terbium Iron alloy has low thermal conductivity and is susceptible to thermal shock, which can affect its performance during sputtering. Indium bonding helps mitigate these issues by providing a more stable and reliable connection between the target and the sputtering apparatus.

Cobalt Terbium Iron Sputtering Target Application

Cobalt Terbium Iron Sputtering Targets are used in a variety of applications, including:

  • Magnetic Storage Devices: Leveraging their magnetic properties for high-density data storage.
  • Magneto-Optical Devices: Utilizing the material’s unique optical and magnetic characteristics for advanced optical data storage and processing.
  • Sensors: Implementing their sensitivity to magnetic fields for precise measurement and detection in various sensor technologies.
  • Electronic and Optical Components: Employing the unique properties of the composite material to enhance the performance of various electronic and optical devices.

Cobalt Terbium Iron Sputtering Target Packaging

Our Cobalt Terbium Iron Sputtering Targets are meticulously managed during storage and transportation to ensure that they maintain their original quality.

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TFM offers Cobalt Terbium Iron Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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