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VD0616 Cobalt Titanium Evaporation Materials, Co/Ti

Catalog No.VD0616
MaterialCobalt Titanium (Co/Ti)
Purity99.9% ~ 99.99%
ShapePowder/ Granule/ Custom-made

TFM excels in manufacturing high-purity cobalt titanium evaporation materials, employing rigorous quality assurance procedures to ensure top-notch product reliability. Our offerings include a diverse range of shapes, including tablets, granules, pellets, and powder, tailored to meet various needs and applications.

MSDS File

Cobalt Titanium Evaporation Materials Description

TFM offers high-purity cobalt titanium evaporation materials, an alloy consisting of cobalt (Co) and titanium (Ti). These materials are essential for high-quality deposition processes, ensuring excellent film quality. Our cobalt titanium evaporation materials achieve up to 99.9995% purity, reflecting our commitment to reliability through stringent quality assurance practices.

Cobalt Titanium Evaporation Materials Applications

Our cobalt titanium evaporation materials are versatile, finding applications in:

  • Deposition Processes: Ideal for semiconductor deposition, chemical vapor deposition (CVD), and physical vapor deposition (PVD).
  • Optics: Used in wear protection, decorative coatings, and displays.

Cobalt Titanium Evaporation Materials Packaging

We ensure that our cobalt titanium evaporation materials are handled with utmost care to avoid damage during storage and transportation. This meticulous approach helps maintain the product’s quality in its original condition.

Contact Us

TFM is a leading provider of high-purity cobalt titanium evaporation materials and various other evaporation products. Available in powder and granule forms, our materials can be customized to meet specific needs. For current pricing and additional information on evaporation materials not listed, please reach out to us with your inquiry.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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