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Cobalt Nickel Chromium Sputtering Target

ST0082 Cobalt Tungsten Sputtering Target, Co/W

Chemical Formula: Co/W
Catalog Number: ST0082
CAS Number: 7440-48-4 | 7440
Purity: 99.9%, 99.95%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Cobalt Tungsten sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Cobalt Tungsten Sputtering Target Description

The Cobalt Tungsten sputtering target from TFM is a silvery alloy material composed of cobalt (Co) and tungsten (W). This high-quality sputtering material is ideal for applications that require the combined properties of these two elements.

Cobalt

Cobalt, symbolized as “Co,” is a chemical element whose name originates from the German word ‘kobald,’ meaning goblin. It was first mentioned in 1732 and observed by G. Brandt. Cobalt has an atomic number of 27 and is located in Period 4, Group 9 of the d-block in the periodic table. Its relative atomic mass is 58.933195(5) Daltons, with the number in brackets indicating the measurement uncertainty.

Related Product: Cobalt Sputtering Target

Tungsten

Tungsten, also known as wolfram, is a chemical element derived from the Swedish words ‘tung sten,’ meaning heavy stone. The symbol “W” is from wolfram, the old name of the tungsten mineral wolframite. Tungsten was first mentioned in 1781 and observed by T. Bergman, with its isolation later achieved and announced by J. and F. Elhuyar. Tungsten has an atomic number of 74 and is located in Period 6, Group 6 of the d-block in the periodic table. Its relative atomic mass is 183.84(1) Daltons, with the number in brackets indicating the measurement uncertainty.

Related Product: Tungsten Sputtering Target

Cobalt Tungsten Sputtering Target Packaging

Our cobalt tungsten sputtering targets are carefully handled to prevent damage during storage and transportation and to preserve the quality of our products in their original condition.

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TFM offers Cobalt Tungsten Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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