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Copper Aluminum Oxide Evaporation Materials

VD0683 Copper Aluminum Oxide Evaporation Materials, CuAlO2

Catalog No.VD0683
MaterialCopper Aluminum Oxide (CuAlO2)
Purity99.9% ~ 99.99%
ShapePowder/ Granule/ Custom-made
TFM is a premier provider of high-purity copper and aluminum oxide evaporation materials, renowned for our extensive range of evaporation products. We supply these materials in both powder and granule forms, with custom options available to meet specific needs.
MSDS File

Introduction

Copper Aluminum Oxide (CuAlO₂) evaporation materials are advanced oxide compounds widely used in transparent electronics and functional oxide thin films. As a representative p-type transparent conducting oxide (TCO) with a delafossite crystal structure, CuAlO₂ has attracted significant interest for applications where optical transparency must be combined with controlled electrical conductivity. These evaporation materials provide a reliable source for producing high-quality CuAlO₂ thin films in research and emerging device development.

Detailed Description

CuAlO₂ is a ternary oxide composed of copper, aluminum, and oxygen, crystallizing in a delafossite structure that enables intrinsic p-type conductivity. Unlike conventional n-type TCOs, CuAlO₂ offers a complementary material platform for transparent p–n junctions, oxide electronics, and optoelectronic devices.

Our Copper Aluminum Oxide evaporation materials are synthesized from high-purity precursor materials under carefully controlled conditions to ensure accurate stoichiometry and phase purity. The material is processed into pellets, granules, or custom forms suitable for vacuum thermal evaporation and electron-beam evaporation systems. Dense and uniform material structure helps maintain stable evaporation behavior while minimizing spitting and compositional drift during deposition.

CuAlO₂ evaporation materials are particularly suitable for research environments where precise control over film composition, optical transparency, and electrical properties is required. When combined with appropriate substrate selection and post-deposition treatments, these materials enable the formation of functional p-type oxide layers for next-generation transparent devices.

Applications

Copper Aluminum Oxide evaporation materials are commonly used in:

  • P-type transparent conducting oxide (TCO) thin films

  • Transparent electronics and oxide semiconductor devices

  • Optoelectronic and photovoltaic research

  • Functional oxide coatings and multilayer structures

  • Thin-film transistors and transparent p–n junctions

  • Academic and industrial R&D on delafossite oxides

Technical Parameters

ParameterTypical Value / RangeImportance
MaterialCopper Aluminum Oxide (CuAlO₂)Defines optical & electrical behavior
Crystal StructureDelafossiteEnables p-type conductivity
Purity99.9% – 99.99%Reduces impurity-related defects
FormPellet / Granule / CustomEnsures stable evaporation
Pellet Size1 – 6 mm (custom available)Compatible with common crucibles
Deposition MethodThermal / E-beam evaporationSuitable for standard PVD systems
Optical TransparencyHigh (visible range)Critical for transparent devices

Comparison with Related Materials

MaterialKey AdvantageTypical Application
CuAlO₂P-type transparencyTransparent electronics
Indium Tin Oxide (ITO)High n-type conductivityDisplays, optoelectronics
Zinc Oxide (ZnO)Wide bandgap, low costTransparent coatings
Nickel Oxide (NiO)P-type oxideHole transport layers

FAQ

QuestionAnswer
Is CuAlO₂ suitable for thermal evaporation?Yes, it is compatible with both thermal and e-beam evaporation.
Can material form be customized?Yes, pellets, granules, and custom forms are available.
Is CuAlO₂ a p-type TCO?Yes, it is a well-known p-type transparent conducting oxide.
How is the material packaged?Vacuum-sealed or inert-gas packed to prevent contamination.

Packaging

Our Copper Aluminum Oxide Evaporation Materials (CuAlO₂) are meticulously tagged and labeled externally to ensure efficient identification and strict quality control. Each batch is vacuum-sealed or packed under inert atmosphere and protected with shock-absorbing materials to prevent damage or contamination during storage and transportation.

Conclusion

Copper Aluminum Oxide evaporation materials provide a dependable and high-purity source for depositing p-type transparent oxide thin films. With controlled composition, stable evaporation performance, and flexible form options, CuAlO₂ is an excellent choice for transparent electronics and advanced oxide research.
For detailed specifications and a quotation, please contact us at sales@thinfilmmaterials.com.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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