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Copper Aluminum Oxide Evaporation Materials

VD0683 Copper Aluminum Oxide Evaporation Materials, CuAlO2

Catalog No.VD0683
MaterialCopper Aluminum Oxide (CuAlO2)
Purity99.9% ~ 99.99%
ShapePowder/ Granule/ Custom-made
TFM is a premier provider of high-purity copper and aluminum oxide evaporation materials, renowned for our extensive range of evaporation products. We supply these materials in both powder and granule forms, with custom options available to meet specific needs.
MSDS File

Copper Aluminum Oxide Evaporation Materials Overview

TFM offers high-purity copper aluminum oxide evaporation materials, characterized by the chemical formula CuAlO2. These materials are essential for ensuring the quality of deposited films in various deposition processes. Our copper aluminum oxide evaporation materials are manufactured with up to 99.9995% purity, reflecting our commitment to excellence and rigorous quality assurance protocols.

Applications

Our copper aluminum oxide evaporation materials are versatile and used in several critical applications, including:

  • Deposition Processes: Ideal for semiconductor deposition, chemical vapor deposition (CVD), and physical vapor deposition (PVD).
  • Optical Uses: Suitable for applications like wear-resistant coatings, decorative finishes, and display technologies.

Packaging and Handling

To ensure optimal quality and prevent damage, our copper aluminum oxide evaporation materials are meticulously tagged and labeled for easy identification. We prioritize careful handling during storage and transportation to maintain the integrity of the materials.

Contact Us

TFM is your trusted partner for high-purity copper aluminum oxide evaporation materials. We offer these materials in various forms, including tablets, granules, rods, and wires. Customized shapes and quantities can be accommodated upon request. In addition to evaporation materials, we also provide evaporation sources, boats, filaments, crucibles, heaters, and e-beam crucible liners. For inquiries regarding current pricing or additional products, please reach out to us.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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