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Copper (Cu) Rotary Sputtering Target

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Introduction

TFM offers high-quality Copper Cu rotary sputtering targets, ideal for thin-film deposition in a variety of advanced applications, including semiconductors, coatings, and electronics. Copper Cu targets are known for their excellent electrical conductivity, thermal conductivity, and high malleability, making them ideal for producing thin films in applications where high performance and reliability are essential.

The rotary sputtering target design ensures efficient and uniform deposition of Copper Cu films, which are widely used in electrical interconnects, thin-film resistors, and capacitors. Copper Cu films provide low resistance, making them perfect for conductive layers in microelectronics and printed circuit boards (PCBs). Additionally, Copper oxide (CuO) films, created from Copper targets, are used in sensor applications and photovoltaic devices due to their optical properties and corrosion resistance.

Copper Cu films are also extensively used in catalysis for chemical processes, particularly in the production of semiconductors and batteries, where Copper’s conductivity plays a vital role. In solar cell production, Copper films are often used as electrical contacts and back electrodes, providing a cost-effective solution for high-efficiency solar cells.

TFM provides customized Copper Cu rotary sputtering targets, offering precise control over material composition and purity to meet the specific deposition needs of industries like electronics, solar energy, and automotive. These targets deliver consistent and high-quality results in thin-film deposition processes, ensuring superior performance and reliable functionality.

Our Copper Cu rotary sputtering targets are manufactured to the highest standards, ensuring superior material quality and consistent sputtering performance. With low impurity levels, high density, and optimized sputtering characteristics, TFM’s Copper Cu targets are ideal for producing high-performance thin films for next-generation technologies.

Specifications

MaterialsCopper Rotary Sputtering Target
SymbolCu
Purity99.9% – 99.9999%
Theoretical Density (g/cc)8.92
Melting Point (°C)1,083
Production MethodSpraying Type / Monolithic Type
Backing TubeTitanium, Stainless Steel
SizeAs per customer’s drawings
Relative Density>= 96%
Grain Sizes< 100 µm
Annual Capacity1000 tons

Applications

  • Pure Cu Film Production
  • PCB Coating
  • Semiconductor Electronics Industry
  • TFT-LCD Coating
  • Construction / Automotive Glass Industry
  • Decorative / Functional Coating Industry

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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